Using lateral vibration for thermosonic flip-chip interconnection with anisotropic conductive film

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In this paper, thermosonic flip-chip bonding with anisotropic conductive film (ACF) is considered. To shorten the ACF curing time, an ultrasonic vibration of 40 kHz in the lateral direction is applied, in addition to the thermocompression process. By measuring the internal temperature of CF, the fast curing of ACF due to ultrasonic vibration is verified. The experiments with a commercialized ACF for the interconnection of LCD driver chips exhibit a notable reduction of bonding time by 77% as well as a reduction of tool-tip temperature while ensuring the bonding reliability. Also, as a typical feature of the proposed method, the sliding phenomenon between the contact surface of the specimen and the horn tool-tip is reported, which significantly enhances the reliability of thermosonic flip-chip bonding. Through the observation of pressured conductive particle
Publisher
IOP PUBLISHING LTD
Issue Date
2010-10
Language
English
Article Type
Article
Keywords

BONDING TEMPERATURE; ADHESIVE FILM; RELIABILITY; TECHNOLOGY; VISCOSITY; PACKAGES

Citation

JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.20, no.10

ISSN
0960-1317
DOI
10.1088/0960-1317/20/10/105015
URI
http://hdl.handle.net/10203/98850
Appears in Collection
ME-Journal Papers(저널논문)
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