Showing results 1 to 25 of 25
A modulus-engineered multi-layer polymer film with mechanical robustness for the application to highly deformable substrate platform in stretchable electronics Kim, Youson; Kim, Junmo; kim, chanyoung; Kim, Taehyun; Lee, Chungryeol; Jeong, Kihoon; Jo, Woosung; et al, CHEMICAL ENGINEERING JOURNAL, v.431, no.2, 2022-03 |
Adhesion improvement of graphene/copper interface using UV/ozone treatments Seo, Jeongmin; Chang, Won Seok; Kim, Taek-Soo, THIN SOLID FILMS, v.584, pp.170 - 175, 2015-06 |
An Electroactive and Transparent Haptic Interface Utilizing Soft Elastomer Actuators with Silver Nanowire Electrodes Jun, Kiwoo; Kim, Jongnam; Oh, Il-Kwon, SMALL, v.14, no.35, 2018-08 |
Broadband Modulation of Terahertz Waves With Non-Resonant Graphene Meta-Devices Lee, Seung Hoon; Kim, Hyeon-Don; Choi, Hyun Joo; Kang, Byungsoo; Cho, Yong Rae; Min, Bumki, IEEE TRANSACTIONS ON TERAHERTZ SCIENCE AND TECHNOLOGY, v.3, no.6, pp.764 - 771, 2013-11 |
Controlled multiple neutral planes by low elastic modulus adhesive for flexible organic photovoltaics Kim, Wansun; Lee, Inhwa; Kim, Dong Yoon; Yu, Youn-Yeol; Jung, Hae-Yoon; Kwon, Seyeoul; Park, Weon Seo; et al, NANOTECHNOLOGY, v.28, no.19, 2017-05 |
Design of ultrathin OLEDs having oxide -based transparent electrodes and encapsulation with sub -mm bending radius Kim, Eungjun; Kwon, Jeonghyun; Kim, Cheolgyu; Kim, Taek-Soo; Choi, Kyung Cheol; Yoo, Seunghyup, ORGANIC ELECTRONICS, v.82, 2020-07 |
Direct micro/nano metal patterning based on two-step transfer printing of ionic metal nano-ink Kim, Sanghyeok; Lee, Won Seok; Lee, Jihye; Park, Inkyu, NANOTECHNOLOGY, v.23, no.28, 2012-07 |
Display process compatible accurate graphene patterning for OLED applications Shin, Jin-Wook; Han, Jun-Han; Cho, Hyunsu; Moon, Jaehyun; Kwon, Byoung-Hwa; Cho, Seungmin; Yoon, Taeshik; et al, 2D Materials, v.5, no.1, 2018-01 |
Effect of printing parameters on gravure patterning with conductive silver ink Kim, Seung-hwan; Sung, Hyung-Jin, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.25, no.4, 2015-04 |
Enhancing Adhesion of Screen-Printed Silver Nanopaste Films Kim, Jae-Han; Kim, Kwang-Seok; Jang, Kyung-Rim; Jung, Seung-Boo; Kim, Taek-Soo, ADVANCED MATERIALS INTERFACES, v.2, no.13, 2015-09 |
Evaluating Mechanical Properties of 100nm-Thick Atomic Layer Deposited Al2o3 as a Free-Standing Film Koo, Junmo; Lee, Sangmin; Kim, Junmo; Kim, Dong Hwan; Choi, Byoung-Ho; Kim, Taek-Soo; Shim, Joon Hyung, SCRIPTA MATERIALIA, v.187, pp.256 - 261, 2020-10 |
Exploiting pi-pi Stacking for Stretchable Semiconducting Polymers Son, Sung Yun; Kim, Jae Han; Song, Eunjoo; Choi, Kyoungwon; Lee, Joohyeon; Cho, Kilwon; Kim, Taek-Soo; et al, MACROMOLECULES, v.51, no.7, pp.2572 - 2579, 2018-04 |
Flexible microdevices based on carbon nanotubes Allen, Ashante; Cannon, Andrew; Lee, Jungchul; King, William P.; Graham, Samuel, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.16, no.12, pp.2722 - 2729, 2006-12 |
Fracture mechanism and electromechanical behavior of chemical vapor deposited graphene on flexible substrate under tension Lee, Jeong Hwan; Jang, Dong Won; Hong, Seong-Gu; Park, Byong Chon; Kim, Jae-Hyun; Jung, Hyun-June; Lee, Soon-Bok, CARBON, v.118, pp.475 - 484, 2017-07 |
High-Performance, Flexible NO2 Chemiresistors Achieved by Design of Imine-Incorporated n-Type Conjugated Polymers Park, Hyeonjung; Kim, Dong-Ha; Ma, Boo Soo; Shin, Euichul; Kim, Youngkwon; Kim, Taek-Soo; Kim, Felix Sunjoo; et al, ADVANCED SCIENCE, v.9, no.14, pp.2200270, 2022-05 |
Mechanical and Electrical Reliability Analysis of Flexible Si Complementary Metal-Oxide-Semiconductor Integrated Circuit Kim, Seungyoon; Kim, Cheolgyu; Bong, Jae Hoon; Hwang, Wan Sik; Kim, Taek-Soo; Oh, Jae Sub; Cho, Byung Jin, JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.19, no.10, pp.6473 - 6480, 2019-10 |
Modeling and analyzing near-junction thermal transport in high-heat-flux GaN devices heterogeneously integrated with diamond Kim, Taeyoung; Song, Changhwan; Park, Sung Il; Lee, Seong Hyuk; Lee, Bong Jae; Cho, Jungwan, INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER, v.143, 2023-04 |
Next Generation Non-Vacuum, Maskless, Low Temperature Nanoparticle Ink Laser Digital Direct Metal Patterning for a Large Area Flexible Electronics Yeo, Jun-Yeob; Hong, Suk-Joon; Lee, Dae-Hoo; Hotz, Nico; Lee, Ming-Tsang; Grigoropoulos, Costas P.; Ko, Seung-Hwan, PLOS ONE, v.7, no.8, 2012-08 |
Overcoming the "retention vs. voltage'' trade-off in nonvolatile organic memory: Ag nanoparticles covered with dipolar self-assembled monolayers as robust charge storage nodes Lee, Seungwon; Lee, Jinhwan; Lee, Hyunsoo; Yuk, Young Ji; Kim, Mincheol; Moon, Hanul; Seo, Jaewon; et al, ORGANIC ELECTRONICS, v.14, no.12, pp.3260 - 3266, 2013-12 |
Plasmonic-Tuned Flash Cu Nanowelding with Ultrafast Photochemical-Reducing and Interlocking on Flexible Plastics Park, Jung Hwan; Han, Seungyong; Kim, Dongkwan; You, Byoung Kuk; Joe, Daniel Juhyung; Hong, Sukjoon; Seo, Jeongmin; et al, ADVANCED FUNCTIONAL MATERIALS, v.27, no.29, 2017-08 |
Quantitative studies of long-term stable, top-down fabricated silicon nanowire pH sensors Choi, Sun; Park, Inkyu; Hao, Zhao; Holman, Hoi-Ying N.; Pisano, Albert P., APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, v.107, no.2, pp.421 - 428, 2012-05 |
Solution Processed Aluminum Paper for Flexible Electronics Lee, Hye-Moon; Lee, Ha-Beom; Jung, Dae-Soo; Yun, Jung-Yeul; Ko, Seung-Hwan; Park, Seung-Bin, LANGMUIR, v.28, no.36, pp.13127 - 13135, 2012-09 |
Switching terahertz waves with gate-controlled active graphene metamaterials Lee, Seung-Hoon; Choi, Mu-Han; Kim, Teun-Teun; Lee, Seung-Woo; Liu, Ming; Yin, Xiaobo; Choi, Hong-Kyw; et al, NATURE MATERIALS, v.11, no.11, pp.936 - 941, 2012-11 |
Top-down fabricated silicon nanowire sensors for real-time chemical detection Park, Inkyu; Li, Zhiyong; Pisano, Albert P.; Williams, R. Stanley, NANOTECHNOLOGY, v.21, no.1, 2010-01 |
Transversally Extended Laser Plasmonic Welding for Oxidation-Free Copper Fabrication toward High-Fidelity Optoelectronics Park, Jung Hwan; Jeong, Sunho; Lee, Eun Jung; Lee, Sun Sook; Seok, Jae Young; Yang, Minyang; Choi, Youngmin; et al, CHEMISTRY OF MATERIALS, v.28, no.12, pp.4151 - 4159, 2016-06 |
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