Browse "Dept. of Mechanical Engineering(기계공학과)" by Subject ADHESIVE FILM
Showing results 1 to 3 of 3
| Effects of the Mechanical Properties of Polymer Resin and the Conductive Ball Types of Anisotropic Conductive Films on the Bending Properties of Chip-in-Flex Package Kim, Young-Lyong; Lee, Tae-Ik; Kim, Ji-Hye; Kim, Wonsik; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.2, pp.200 - 207, 2016-02 |
| Elastic region of an ACF joint for thermosonic flip-chip bonding Ha, Chang-Wan; Jang, Tae-Young; Kim, Kyung-Rok; Yun, Won-Soo; Kim, Kyung-Soo, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.21, no.9, 2011-09 |
| Using lateral vibration for thermosonic flip-chip interconnection with anisotropic conductive film Kim, Kyung-Soo; Ha, CW; Jang, TY; Joung, SW; Yun, WS, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.20, no.10, 2010-10 |
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