Isothermal low cycle fatigue tests of Sn/3.5 Ag/0.75 Cu and 63Sn/37Pb solder joints under mixed-mode loading cases
- Issue Date
- 2002-05-28
- Language
- ENG
- Citation
52nd Electronic Components and Technology Conference, pp.979 - 984
- ISSN
- 0569-5503
- Appears in Collection
- ME-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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