Development of a New Device for Measuring Thermal Stresses

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dc.contributor.authorKim, Jin-Keun-
dc.contributor.authorJeon, SE-
dc.contributor.authorKim, KH-
dc.contributor.authorHyun, JY-
dc.date.accessioned2013-03-16T07:20:12Z-
dc.date.available2013-03-16T07:20:12Z-
dc.date.created2012-02-06-
dc.date.issued2000-
dc.identifier.citationInternational Workshop on Control of Cracking in Early-age Concrete, v., no., pp.115 - 122-
dc.identifier.urihttp://hdl.handle.net/10203/128798-
dc.languageENG-
dc.titleDevelopment of a New Device for Measuring Thermal Stresses-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage115-
dc.citation.endingpage122-
dc.citation.publicationnameInternational Workshop on Control of Cracking in Early-age Concrete-
dc.identifier.conferencecountryJapan-
dc.identifier.conferencecountryJapan-
dc.contributor.localauthorKim, Jin-Keun-
dc.contributor.nonIdAuthorJeon, SE-
dc.contributor.nonIdAuthorKim, KH-
dc.contributor.nonIdAuthorHyun, JY-
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CE-Conference Papers(학술회의논문)
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