Numerical Analysis of Coined Eutectic Solder Bumps

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Issue Date
2002
Language
KOR
Citation

KSME 2002 Conference of Materials and Fracture Division, KSME 02MF025, pp.158 - 163

URI
http://hdl.handle.net/10203/127997
Appears in Collection
ME-Conference Papers(학술회의논문)
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