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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Experimental analysis of shrouded pin fin heat sinks for electronic equipment cooling

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dc.contributor.authorRyu, H.C.ko
dc.contributor.authorKim, D.ko
dc.contributor.authorKim, SungJinko
dc.date.accessioned2013-03-16T02:33:52Z-
dc.date.available2013-03-16T02:33:52Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2002-05-30-
dc.identifier.citation8th Intersociety Conference on Thermal and Thermommechanical phenomena in Electronic Systems, 2002, pp.261 - 266-
dc.identifier.urihttp://hdl.handle.net/10203/126527-
dc.languageEnglish-
dc.publisherIntersociety Conference on Thermal and Thermommechanical phenomena in Electronic Systems-
dc.titleExperimental analysis of shrouded pin fin heat sinks for electronic equipment cooling-
dc.typeConference-
dc.identifier.wosid000177323800036-
dc.identifier.scopusid2-s2.0-0036459783-
dc.type.rimsCONF-
dc.citation.beginningpage261-
dc.citation.endingpage266-
dc.citation.publicationname8th Intersociety Conference on Thermal and Thermommechanical phenomena in Electronic Systems, 2002-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationSan Diego, CA-
dc.contributor.localauthorKim, SungJin-
dc.contributor.nonIdAuthorRyu, H.C.-
dc.contributor.nonIdAuthorKim, D.-
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ME-Conference Papers(학술회의논문)
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