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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Measurement of Thermal Deformations of Electronic packages using Moire Interferometry

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dc.contributor.authorLee, Soon-Bok-
dc.contributor.authorHam, SJ-
dc.date.accessioned2013-03-16T01:59:37Z-
dc.date.available2013-03-16T01:59:37Z-
dc.date.created2012-02-06-
dc.date.issued2000-
dc.identifier.citationKSME 2000 Conference of Materials and Frcture Division, v., no., pp.314 - 320-
dc.identifier.urihttp://hdl.handle.net/10203/126271-
dc.languageKOR-
dc.titleMeasurement of Thermal Deformations of Electronic packages using Moire Interferometry-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage314-
dc.citation.endingpage320-
dc.citation.publicationnameKSME 2000 Conference of Materials and Frcture Division-
dc.identifier.conferencecountrySouth Korea-
dc.identifier.conferencecountrySouth Korea-
dc.contributor.localauthorLee, Soon-Bok-
dc.contributor.nonIdAuthorHam, SJ-
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ME-Conference Papers(학술회의논문)
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