DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Soon-Bok | - |
dc.contributor.author | Ham, SJ | - |
dc.date.accessioned | 2013-03-16T01:59:37Z | - |
dc.date.available | 2013-03-16T01:59:37Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2000 | - |
dc.identifier.citation | KSME 2000 Conference of Materials and Frcture Division, v., no., pp.314 - 320 | - |
dc.identifier.uri | http://hdl.handle.net/10203/126271 | - |
dc.language | KOR | - |
dc.title | Measurement of Thermal Deformations of Electronic packages using Moire Interferometry | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 314 | - |
dc.citation.endingpage | 320 | - |
dc.citation.publicationname | KSME 2000 Conference of Materials and Frcture Division | - |
dc.identifier.conferencecountry | South Korea | - |
dc.identifier.conferencecountry | South Korea | - |
dc.contributor.localauthor | Lee, Soon-Bok | - |
dc.contributor.nonIdAuthor | Ham, SJ | - |
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