Measurement of Thermal Deformations of Chip Scale Packages Using Moire Interferometry
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Ham, SJ | - |
| dc.contributor.author | Hwang, TK | - |
| dc.contributor.author | Lee, Soon-Bok | - |
| dc.date.accessioned | 2013-03-16T01:58:43Z | - |
| dc.date.available | 2013-03-16T01:58:43Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2001 | - |
| dc.identifier.citation | SEMICON Korea Technical Symposium 2001, Serial 14, v., no., pp.239 - 244 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/126265 | - |
| dc.language | KOR | - |
| dc.title | Measurement of Thermal Deformations of Chip Scale Packages Using Moire Interferometry | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 239 | - |
| dc.citation.endingpage | 244 | - |
| dc.citation.publicationname | SEMICON Korea Technical Symposium 2001, Serial 14 | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | Lee, Soon-Bok | - |
| dc.contributor.nonIdAuthor | Ham, SJ | - |
| dc.contributor.nonIdAuthor | Hwang, TK | - |
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