Measurement of the degree of cure of glass fiber-epoxy composites using dielectrometry
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Bang K.G. | - |
| dc.contributor.author | Kwon J.W. | - |
| dc.contributor.author | Lee, Dai Gil | - |
| dc.contributor.author | Lee J.W. | - |
| dc.date.accessioned | 2013-03-16T00:26:29Z | - |
| dc.date.available | 2013-03-16T00:26:29Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2001-06-25 | - |
| dc.identifier.citation | 5th Asia Pacific Conference on Materials Processing, v.113, no.40546, pp.209 - 214 | - |
| dc.identifier.issn | 0924-0136 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/125546 | - |
| dc.language | ENG | - |
| dc.title | Measurement of the degree of cure of glass fiber-epoxy composites using dielectrometry | - |
| dc.type | Conference | - |
| dc.identifier.scopusid | 2-s2.0-0035876577 | - |
| dc.type.rims | CONF | - |
| dc.citation.volume | 113 | - |
| dc.citation.issue | 40546 | - |
| dc.citation.beginningpage | 209 | - |
| dc.citation.endingpage | 214 | - |
| dc.citation.publicationname | 5th Asia Pacific Conference on Materials Processing | - |
| dc.contributor.localauthor | Bang K.G. | - |
| dc.contributor.localauthor | Kwon J.W. | - |
| dc.contributor.localauthor | Lee, Dai Gil | - |
| dc.contributor.nonIdAuthor | Lee J.W. | - |
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