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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Material properties and thermal stress analysis of EMC with different filler shape and volume fraction in electronic packaging

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dc.contributor.authorShin, D. K.-
dc.contributor.authorLee, Jungju-
dc.contributor.authorHong,C. S.-
dc.date.accessioned2013-03-15T23:41:07Z-
dc.date.available2013-03-15T23:41:07Z-
dc.date.created2012-02-06-
dc.date.issued1996-
dc.identifier.citationProceedings of KSME Annual Conference (Materials and Fracture), v., no., pp.21 - 26-
dc.identifier.urihttp://hdl.handle.net/10203/125175-
dc.languageENG-
dc.titleMaterial properties and thermal stress analysis of EMC with different filler shape and volume fraction in electronic packaging-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage21-
dc.citation.endingpage26-
dc.citation.publicationnameProceedings of KSME Annual Conference (Materials and Fracture)-
dc.identifier.conferencecountrySouth Korea-
dc.identifier.conferencecountrySouth Korea-
dc.contributor.localauthorLee, Jungju-
dc.contributor.nonIdAuthorShin, D. K.-
dc.contributor.nonIdAuthorHong,C. S.-
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ME-Conference Papers(학술회의논문)
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