DC Field | Value | Language |
---|---|---|
dc.contributor.author | Shin, D. K. | - |
dc.contributor.author | Lee, Jungju | - |
dc.contributor.author | Hong,C. S. | - |
dc.date.accessioned | 2013-03-15T23:41:07Z | - |
dc.date.available | 2013-03-15T23:41:07Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1996 | - |
dc.identifier.citation | Proceedings of KSME Annual Conference (Materials and Fracture), v., no., pp.21 - 26 | - |
dc.identifier.uri | http://hdl.handle.net/10203/125175 | - |
dc.language | ENG | - |
dc.title | Material properties and thermal stress analysis of EMC with different filler shape and volume fraction in electronic packaging | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 21 | - |
dc.citation.endingpage | 26 | - |
dc.citation.publicationname | Proceedings of KSME Annual Conference (Materials and Fracture) | - |
dc.identifier.conferencecountry | South Korea | - |
dc.identifier.conferencecountry | South Korea | - |
dc.contributor.localauthor | Lee, Jungju | - |
dc.contributor.nonIdAuthor | Shin, D. K. | - |
dc.contributor.nonIdAuthor | Hong,C. S. | - |
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