DC Field | Value | Language |
---|---|---|
dc.contributor.author | Ham, SJ | - |
dc.contributor.author | Lee, Soon-Bok | - |
dc.date.accessioned | 2013-03-15T18:54:24Z | - |
dc.date.available | 2013-03-15T18:54:24Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1995 | - |
dc.identifier.citation | 1995 SEM Spring Conference on Experimental Mechanics, v., no., pp.713 - 719 | - |
dc.identifier.uri | http://hdl.handle.net/10203/122674 | - |
dc.language | ENG | - |
dc.title | An Experimental Study on the Integrity of the Electronic Pakaging Subjected to Environmental Vibration | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 713 | - |
dc.citation.endingpage | 719 | - |
dc.citation.publicationname | 1995 SEM Spring Conference on Experimental Mechanics | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Lee, Soon-Bok | - |
dc.contributor.nonIdAuthor | Ham, SJ | - |
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