DC Field | Value | Language |
---|---|---|
dc.contributor.author | Earmme, Youn-Young | - |
dc.date.accessioned | 2013-03-15T17:04:13Z | - |
dc.date.available | 2013-03-15T17:04:13Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1998 | - |
dc.identifier.citation | International Conference on Electronic Materials, v., no., pp. - | - |
dc.identifier.uri | http://hdl.handle.net/10203/121619 | - |
dc.language | ENG | - |
dc.title | A Measurement of the Interfacial Fracture Toughness between Chip and Lead frame | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | International Conference on Electronic Materials | - |
dc.identifier.conferencecountry | South Korea | - |
dc.identifier.conferencecountry | South Korea | - |
dc.contributor.localauthor | Earmme, Youn-Young | - |
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