DSpace at KOASAS: Effects of Plating Condition on the Growth of Cu-Sn Intermetallic Compounds of 80Sn-20Pb Electrodeposits on Cu-Based Leadframe Alloy

DSpace at KOASAS

College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Effects of Plating Condition on the Growth of Cu-Sn Intermetallic Compounds of 80Sn-20Pb Electrodeposits on Cu-Based Leadframe Alloy

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Kwon, Hyuk-Sang researcher

Issue Date: 1995-01-01

Language: ENG

Citation: pp.603 - 609

URI: http://hdl.handle.net/10203/119910

Appears in Collection: MS-Conference Papers(학술회의논문)

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Effects of Plating Condition on the Growth of Cu-Sn Intermetallic Compounds of 80Sn-20Pb Electrodeposits on Cu-Based Leadframe Alloy

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