Effects of Plating Condition on the Growth of Cu-Sn Intermetallic Compounds of 80Sn-20Pb Electrodeposits on Cu-Based Leadframe Alloy
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kwon, Hyuk-Sang | - |
| dc.date.accessioned | 2013-03-15T13:36:50Z | - |
| dc.date.available | 2013-03-15T13:36:50Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1995-01-01 | - |
| dc.identifier.citation | , v., no., pp.603 - 609 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/119910 | - |
| dc.language | ENG | - |
| dc.title | Effects of Plating Condition on the Growth of Cu-Sn Intermetallic Compounds of 80Sn-20Pb Electrodeposits on Cu-Based Leadframe Alloy | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 603 | - |
| dc.citation.endingpage | 609 | - |
| dc.contributor.localauthor | Kwon, Hyuk-Sang | - |
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.