Resistivity, step coverage and barrier property of TiN/Ti films prepared by electron cyclotron resonance plasma enhanced chemical vapor deposition
- Issue Date
- 1997-01-01
- Language
- ENG
- Citation
Proceedings of ULSI XII : 1996 Advanced Metallization and Interconnect Systems for ULSI Applications, pp.297 - 303
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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