Flip Chip Assembly on Board using Anisotropic Conductive Film and Electroless Ni/Au Bumps
- Publisher
- 한국재료학회
- Issue Date
- 1998-11-01
- Language
- KOR
- Citation
한국재료학회 추계학술대회, pp.81 - 81
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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