Thermal buckling analysis of composite cylindrical panels with embedded SMA wires
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, H.J. | - |
| dc.contributor.author | Lee, Jungju | - |
| dc.date.accessioned | 2013-03-15T07:54:45Z | - |
| dc.date.available | 2013-03-15T07:54:45Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1997-11 | - |
| dc.identifier.citation | KSCM Annual Autumn Conference, v., no., pp.169 - 173 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/117599 | - |
| dc.language | ENG | - |
| dc.title | Thermal buckling analysis of composite cylindrical panels with embedded SMA wires | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 169 | - |
| dc.citation.endingpage | 173 | - |
| dc.citation.publicationname | KSCM Annual Autumn Conference | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | Lee, Jungju | - |
| dc.contributor.nonIdAuthor | Lee, H.J. | - |
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