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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Performance of a Conduction Cooling Module

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dc.contributor.authorSong, Tae-Ho-
dc.contributor.authorBang, SY-
dc.date.accessioned2009-09-04T07:01:35Z-
dc.date.available2009-09-04T07:01:35Z-
dc.date.created2012-02-06-
dc.date.issued1990-03-
dc.identifier.citationJournal of Electronic Packaging, v.112, no.1, pp.52 - 56-
dc.identifier.issn1043-7398-
dc.identifier.urihttp://hdl.handle.net/10203/11002-
dc.languageENG-
dc.language.isoen_USen
dc.publisherAmerican Society of Mechanical Engineers (ASME)-
dc.titlePerformance of a Conduction Cooling Module-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.volume112-
dc.citation.issue1-
dc.citation.beginningpage52-
dc.citation.endingpage56-
dc.citation.publicationnameJournal of Electronic Packaging-
dc.identifier.conferencecountrySouth Korea-
dc.identifier.conferencecountrySouth Korea-
dc.contributor.localauthorSong, Tae-Ho-
dc.contributor.nonIdAuthorBang, SY-
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ME-Conference Papers(학술회의논문)

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