DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim T.W. | - |
dc.contributor.author | Im S. | - |
dc.contributor.author | Earmme, Youn-Young | - |
dc.date.accessioned | 2013-03-14T08:40:02Z | - |
dc.date.available | 2013-03-14T08:40:02Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1990-07-06 | - |
dc.identifier.citation | Proceedings of the KSME/JSME Joint Conference, v., no., pp.403 - 408 | - |
dc.identifier.issn | 0252-1059 | - |
dc.identifier.uri | http://hdl.handle.net/10203/107095 | - |
dc.language | ENG | - |
dc.title | Thermoelastic analysis of an interfacial crack in bimaterial | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-0025791136 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 403 | - |
dc.citation.endingpage | 408 | - |
dc.citation.publicationname | Proceedings of the KSME/JSME Joint Conference | - |
dc.identifier.conferencecountry | South Korea | - |
dc.identifier.conferencecountry | South Korea | - |
dc.contributor.localauthor | Earmme, Youn-Young | - |
dc.contributor.nonIdAuthor | Kim T.W. | - |
dc.contributor.nonIdAuthor | Im S. | - |
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