Thermoelastic analysis of an interfacial crack in bimaterial

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dc.contributor.authorKim T.W.-
dc.contributor.authorIm S.-
dc.contributor.authorEarmme, Youn-Young-
dc.date.accessioned2013-03-14T08:40:02Z-
dc.date.available2013-03-14T08:40:02Z-
dc.date.created2012-02-06-
dc.date.issued1990-07-06-
dc.identifier.citationProceedings of the KSME/JSME Joint Conference, v., no., pp.403 - 408-
dc.identifier.issn0252-1059-
dc.identifier.urihttp://hdl.handle.net/10203/107095-
dc.languageENG-
dc.titleThermoelastic analysis of an interfacial crack in bimaterial-
dc.typeConference-
dc.identifier.scopusid2-s2.0-0025791136-
dc.type.rimsCONF-
dc.citation.beginningpage403-
dc.citation.endingpage408-
dc.citation.publicationnameProceedings of the KSME/JSME Joint Conference-
dc.identifier.conferencecountrySouth Korea-
dc.identifier.conferencecountrySouth Korea-
dc.contributor.localauthorEarmme, Youn-Young-
dc.contributor.nonIdAuthorKim T.W.-
dc.contributor.nonIdAuthorIm S.-
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ME-Conference Papers(학술회의논문)
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