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Showing results 167161 to 167180 of 275771
| Reliability Improvement of Gate-All-Around Junctionless SONOS Memory by Joule Heat From Inherent Nanowire Current Lee, Jung-Woo; Han, Joon-Kyu; Kim, Myung-Su; Yu, Ji-Man; Jung, Jin-Woo; Yun, Seong-Yun; Choi, Yang-Kyu, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.69, no.11, pp.6133 - 6138, 2022-11 |
| Reliability Improvement of Gate-All-Around SONOS Memory by Joule Heat From Gate-Induced Drain Leakage Current Lee, Jung-Woo; Han, Joon-Kyu; Yu, Ji-Man; Lee, Geon-Beom; Tcho, Il-Woong; Choi, Yang-Kyu, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.69, no.1, pp.115 - 119, 2022-01 |
| Reliability improvement of microprocessor systemlink Hong, Sun-Gi; 홍선기; et al, 한국과학기술원, 1977 |
| Reliability improvement of nonlinear ultrasonic modulation based fatigue crack detection using feature-level data fusion Lim, Hyung Jin; Kim, Yongtak; Sohn, Hoon; Jeon, Ikgeun; Liu, Peipei, SMART STRUCTURES AND SYSTEMS, v.20, no.6, pp.683 - 696, 2017-12 |
| Reliability improvement of satellite-based quantum key distribution systems using retransmission scheme Nguyen, Nam D.; Phan, Hang T. T.; Pham, Hien T. T.; Mai, Vuong V.; Dang, Ngoc T., PHOTONIC NETWORK COMMUNICATIONS, v.42, no.1, pp.27 - 39, 2021-08 |
| Reliability Improvement of Solder Anisotropic Conductive Film (ACF) Joints by Controlling ACF Polymer Resin Properties Kim, Yoo-Sun; Kim, Seung-Ho; Shin, Jiwon; Paik, Kyung-Wook, 65th Electronic Components and Technology Conference, IEEE Electronic Components and Technology Conference, 2015-05-27 |
| Reliability improvements of SS7 signaling protocol architecture using ATM technology Lee, SungWon; Song, Young-Jae; Cho, Dong-Ho, IEEE International Conference on Communications, ICC 1998, pp.1415 - 1419, IEEE, 1998-06 |
| Reliability issue related to dielectric charging in Capacitive Micromachined Ultrasonic Transducers: a review Munir, Junaid; Ain, Quratul; Lee, Hyunjoo Jenny, MICROELECTRONICS RELIABILITY, v.92, pp.155 - 167, 2019-01 |
| Reliability issues and role of defects in high-k dielectric HfO2 devices Kang, JG; Kim, DY; Chang, Kee-Joo, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.50, pp.552 - 557, 2007-03 |
| Reliability issues in multi-gate FinFETs Choi, Yang-Kyu; Han, J.-W.; Lee, H., ICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology, pp.1101 - 1104, 2006-10-23 |
| Reliability measure approach for confidence-based design optimization under insufficient input data Jung, Yongsu; Cho, Hyunkyoo; Lee, Ikjin, STRUCTURAL AND MULTIDISCIPLINARY OPTIMIZATION , v.60, no.5, pp.1967 - 1982, 2019-11 |
| Reliability measure for sound source localization Jeon, Hyejeong; Kim, Seungil; Kim, Lag-Yong; Lee, Hee-Youn; Yoon, Hyunsoo, IEICE ELECTRONICS EXPRESS, v.5, no.6, pp.192 - 197, 2008-03 |
| Reliability Modeling and Analysis of Catastrophic Failure and Degradation Data Kim, SH; Kim, DH; Yum, Bong-Jin, International Conference on Industrial Engineering, 2007-11-01 |
| Reliability modeling of digital component in plant protection system with various fault-tolerant techniques Kim, Bo Gyung; Kang, Hyun Gook; Kim, Hee Eun; Lee, Seung Jun; Seong, Poong-Hyun, NUCLEAR ENGINEERING AND DESIGN, v.265, pp.1005 - 1015, 2013-12 |
| Reliability modeling of safety-critical network communication in a digitalized nuclear power plant Lee, Sang Hun; Kim, Hee Eun; Son, Kwang Seop; Shin, Sung Min; Lee, SJ; Kang, Hyun Gook, RELIABILITY ENGINEERING & SYSTEM SAFETY, v.144, pp.285 - 295, 2015-12 |
| Reliability of a System with Standbys and Spares 박경수, 대한산업공학회지, v.3, no.1, 1977-11 |
| Reliability of aerodynamic analysis using a moment method Lee, Jaehun; Kang, Hee Youb; Kwon, Jang-Hyuk; Kwak, Byung Man, INTERNATIONAL JOURNAL OF COMPUTATIONAL FLUID DYNAMICS, v.23, no.6, pp.495 - 502, 2009 |
| Reliability of Anchor Pile of Offshore Guyed Tower Yun, Chung Bang, First Pacific/Asia Offshore Mechanics Symposium, v.0, no.0, pp.0 - 0, 1990-06-01 |
| Reliability of Barrier Ribs in a Flexible Photoluminescent Display Choi, Kyung Cheol; Jang, C; Kim, SH; Kim, KJ; Ahn, SI, Material Research Society, 2009-11-30 |
| Reliability of BCB Passivated InAlAs/InGaAs HEMTs Under Thermal Stress Kim, D; Yoon, M; Kim, T; Yang, Kyounghoon, IEEE, International Symposium on Compound Semiconductors, pp.231 - 232, IEEE, 2003 |
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