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Showing results 203281 to 203300 of 279418

203281
Thermal Cycling Effect on the Mechanical Properties of AISI 4340 Steel

H.S. Kim; C.H. Kim, 대한금속학회지, v.20, no.8, pp.696 - 702, 1982-08

203282
THERMAL CYCLING EFFECTS ON THE BIOREACTOR PERFORMANCES OF IMMOBILIZED BETA-GALACTOSIDASE IN TEMPERATURE-SENSITIVE HYDROGEL BEADS

park, tae gwan; Hoffman, A.S, ENZYME AND MICROBIAL TECHNOLOGY, v.15, no.6, pp.476 - 482, 1993

203283
Thermal cycling reliability and delamination of anisotropic conductive adhesives flip chip on organic substrates with emphasis on the thermal deformation

Kwon, WS; Yim, MJ; Paik, Kyung-Wook; Ham, SJ; Lee, Soon-Bok, JOURNAL OF ELECTRONIC PACKAGING, v.127, pp.86 - 90, 2005-06

203284
Thermal Cycling Reliability Issue of Thick Cu Column Based Cu/SnAg Double-Bump Flip Chip Assemblies on Organic Substrates for Fine Pitch Applications

Lee, Soon-Bok; Son, HY; Kim, I; Park, JH; Jung, GJ; Park, BJ; Byun, KY; et al, EPTC 2008, 2008

203285
Thermal cycling reliability of Cu/SnAg double-bump flip chip assemblies for 100 mu m pitch applications

Son, Ho-Young; Kim, Ilho; Lee, Soon-Bok; Jung, Gi-Jo; Park, Byung-Jin; Paik, Kyung-Wook, JOURNAL OF APPLIED PHYSICS, v.105, no.1, 2009-01

203286
Thermal cycling reliability of Cu/SnAg double-bump flip-chip assemblies for 100um pitch applications

Son, HY; Kim, IH; Lee, Soon-Bok; Jung, GJ; Park, BJ; Paik, KW, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 2007-11-19

203287
Thermal cycling 열처리 가 AISI 4330강 의 현미경조직 과 기계적성질 에 미치는 효과 에 대한 연구

J.S. Chun, JOURNAL OF THE KOREAN INSTITUTE OF METALS, v.19, no.3, pp.208 - 217, 1981

203288
Thermal cycling 열처리가 A.I.S.I. 4340강의 피로 균열 성장에 미치는 영향 = Effect of thermal cycling heat treatment on fatigue crack growth in A.I.S.I. 4340 steellink

이형근; Lee, Hyung-Geun; et al, 한국과학기술원, 1981

203289
Thermal cycling 이 $MmNi_{4.5}Al_{0.5}$ 및 $MmNi_{4.15}Fe_{0.85}$의 수소화 반응 특성에 미치는 영향에 관한 연구 = A study on the changes of hydrogenation properties induced by thermal cyclings in $MmNi_{4.5}Al_{0.5}$ and $MmNi_{4.15}Fe_{0.85}$link

김근홍; Kim, Geun-Hong; 이재영; 이채우; et al, 한국과학기술원, 1986

203290
Thermal deactivation of MgCl2/THF/TiCl4 bimetallic complex catalyst in ethylene polymerization

Choi, HG; Woo, Seong-Ihl, 2nd EurAsia Conf. on Chemistry, pp.391 - 392, 1990

203291
Thermal decomposition and deformation of dye and polycarbonate in compact disc-recordables

Huh, YJ; Kim, SH; Kim, Sung Chul, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.36, no.12A, pp.7233 - 7238, 1997-12

203292
Thermal Decomposition and Spectroscopic Studies of Preheated Ammonia Borane

Zhang, Junshe; Zhao, Yu; Akins, Daniel L.; Lee, Jae Woo, JOURNAL OF PHYSICAL CHEMISTRY C, v.114, no.45, pp.19529 - 19534, 2010-11

203293
Thermal decomposition kinetics of ammonium uranyl carbonate

Kim, E.H.; Park, J.J.; Park, J.H.; Chang, I.S.; Choi, C.S.; Kim, Sang Done, JOURNAL OF NUCLEAR MATERIALS, v.209, no.3, pp.294 - 300, 1994

203294
Thermal Decomposition Kinetics of AUC

김상돈, Proc. of Korea Nuclear Energy Society Autumn Annual Meeting, 1990

203295
Thermal decomposition of Ru(EtCp)2 and metallorganic chemical vapor deposition of Ruthenium thin films using Ru(EtCp)2

No, Kwangsoo; Choi, Jong Wan; Hong, Jong In; Heo, Jung Shik; Moon, Sang Heup, 203rd Meeting of The Electrochemical Society, v.0, no.0, pp.0 - 0, ECS, 2003-04-28

203296
Thermal decomposition 방법을 이용한 AgCu 2원계 나노입자의 합성과 물성평가

김나래; 정인유; 조윤환; 이혁모, 대한금속재료학회 춘계학술대회, 2012-04-27

203297
Thermal decomposition 방법을 이용한 Cu2O 나노입자의 합성과 밴드갭 에너지 변화측정

김나래; 정인유; 조윤환; 이혁모, 대한금속재료학회 추계 학술대회, 대한금속재료학회, 2012-10-25

203298
Thermal Deformation and Decomposition of Dye and Polycarbonate in Compact Disc-Recordables.

Kim, Sung Chul, Pacific Polymer Conference, 1997

203299
Thermal Deformations of CSP Assembly during Temperature Cycling and Power Cycling

Ham, SJ; Lee, Soon-Bok, Int. symposium on Electronic Materials and Packaging, Serial 11, pp.350 - 357, IEEE, 2000-11

203300
Thermal Degradation Mechanism of PTFE

Jun, HS; Woo, Seong-Ihl; Park, KY, 1987 한국고분자학회 추계학술발표회, 한국고분자학회, 1987-10

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