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| Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure With Thermal Transmission Line for High Bandwidth Memory Module Son, Keeyoung; Kim, Seongguk; Park, Hyunwook; Shin, Taein; Kim, Keunwoo; Kim, Minsu; Sim, Boogyo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.12, no.9, pp.1542 - 1556, 2022-09 |
| Thermal and stress analysis of a fuel pellet using the finite element method = 유한요소법을 이용한 핵연료 페레트의 온도 및 응력 해석link Jeong, Jong-Tae; 정종태; et al, 한국과학기술원, 1986 |
| Thermal and structural analysis of a polymer bilayer film as an erasable optical material Jung, HeeTae, MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, v.64, no.1, pp.12 - 18, 1999 |
| Thermal annealing chracteristics of amorphous silicon-based solar cells incorporating stable protocrystalline silicon and unstable microcrystalline silicon at the onset of a microcrystalline regime Ahn, J.Y.; Jun, K.H.; Konagai, M.; Lim, Koeng Su, Proceddings of the 3rd World Conference on Photovoltaic Energy Conversion, pp.1741 - 1744, 2003-05-11 |
| Thermal annealing effects on the photoluminescence of InGaN/GaN quantum wells Lee, WH; Kim, KS; Yang, GM; Hong, CH; Lim, KY; Suh, EK; Lee, HJ; et al, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.39, no.1, pp.136 - 140, 2001-07 |
| Thermal annealing induced bicontinuous networks in bulk heterojunction solar cells and bipolar field-effect transistors Kong, Ho-Youl; Moon, Ji-Sun; Cho, Nam-Sung; Jung, In-Hwan; Park, Moo-Jin; Park, Jong-Hwa; Cho, Shin-Uk; et al, APPLIED PHYSICS LETTERS, v.95, no.17, pp.173301-1 - 173301-3, 2009-10 |
| Thermal Annealing 효과에 의한 다층박막 FBAR 소자의 공진특성개선 윤기완; 김동현; 임문혁; Linh, Mai, 한국해양정보통신학회추계학술대회, pp.633 - 636, 한국해양정보통신학회, 2003-10 |
| Thermal Aspects of Micro-Mechanical Engineering Kim, SungJin, Internal Symposium on Micro-Mechanical Engineering, pp.115 - 124, 2003 |
| Thermal Assisted UV-Ozone Treatment to Improve Reliability of Ag Nanoparticle Thin Films Lee, I.; Lee, J.; Ko, Seung Hwan; Kim, Taek-Soo, 15th International Conference on Electronic Materials and Packaging, Electronic Materials and Packaging (EMAP), 2013-10-06 |
| Thermal Assisted UV-Ozone Treatment to Improve Reliability of Ag Nanoparticle Thin Films 이인화; 김택수, 마이크로전자 및 패키징학회지, v.21, no.1, pp.41 - 44, 2014-03 |
| Thermal Behavior Analysis of TDLAS Sensor under Wall Heat Flux of Scramjet Intake Kim, Gyeongrok; Shim, HanSeul; Jung, Sion; Min, Tae-Hong; PARK, GISU, The 34th International Symposium on Shock Waves, National Symposium on Shock Waves Korea, 2023-07-18 |
| Thermal behavior of alkali-activated fly ash/slag with the addition of an aerogel as an aggregate replacement Seo, Joonho; Bae, S. J.; Jang, DaeIk; Park, Solmoi; Yang, Beomjoo; Lee, Haeng-Ki, CEMENT & CONCRETE COMPOSITES, v.106, pp.103462, 2020-02 |
| Thermal Behavior of Boronsilicate Molecular Sieve Woo, Seong-Ihl; Hong, SB; Lee, JK; Uh, YS, Korea Chemical Society Fall Symposium, Korea Chemical Society, 1987 |
| Thermal behavior of crosslinked gelatin with poly(N-isopropylacrylamide) grafts Kang, HS; Kim, BY; Kim, Jong-Duk, The 10th Symposium on Chemical Engineering Taejeon/Chungnam-Kyushu, pp.0 - 0, 1997-11-01 |
| Thermal behavior of semifluoronated smectic liquid crystals 윤동기; 김대석; 오성대; 김윤호, 2013 춘계학술대회 한국고분자학회, 한국고분자학회, 2013-04-12 |
| Thermal behavior of Sn nanowires for nano-interconnection Shin, H; Song, J; Yu, Jin, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 2007-11-19 |
| Thermal buckling analysis of composite cylindrical panels with embedded SMA wires Lee, H.J.; Lee, Jungju, KSCM Annual Autumn Conference, pp.169 - 173, 1997-11 |
| Thermal buckling and acoustic vibration characteristics of the shape memory alloy hybrid composite plate Lee, In; Kim, Eun-Ho; Rim, Mi-Sun, 18th International Congress on Sound and Vibration, International Congress on Sound and Vibration, 2011-07-11 |
| Thermal buckling and deformation of aerospace structures and their improvement with shape memory alloys Lee, In; Kim, E.-H; Roh, J.-H, 8th International Congress on Thermal Stresses, pp.65 - 65, 2009-06-02 |
| Thermal buckling and postbuckling analysis of a laminated composite beam with embedded SMA actuators Lee, Jungju; Choi S., 10th International Conference on Composite Structures, v.47, no.40547, pp.695 - 703, 1999-11-15 |
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