203281 | Thermal Cycling Effect on the Mechanical Properties of AISI 4340 Steel H.S. Kim; C.H. Kim, 대한금속학회지, v.20, no.8, pp.696 - 702, 1982-08 |
203282 | THERMAL CYCLING EFFECTS ON THE BIOREACTOR PERFORMANCES OF IMMOBILIZED BETA-GALACTOSIDASE IN TEMPERATURE-SENSITIVE HYDROGEL BEADS park, tae gwan; Hoffman, A.S, ENZYME AND MICROBIAL TECHNOLOGY, v.15, no.6, pp.476 - 482, 1993 |
203283 | Thermal cycling reliability and delamination of anisotropic conductive adhesives flip chip on organic substrates with emphasis on the thermal deformation Kwon, WS; Yim, MJ; Paik, Kyung-Wook; Ham, SJ; Lee, Soon-Bok, JOURNAL OF ELECTRONIC PACKAGING, v.127, pp.86 - 90, 2005-06 |
203284 | Thermal Cycling Reliability Issue of Thick Cu Column Based Cu/SnAg Double-Bump Flip Chip Assemblies on Organic Substrates for Fine Pitch Applications Lee, Soon-Bok; Son, HY; Kim, I; Park, JH; Jung, GJ; Park, BJ; Byun, KY; et al, EPTC 2008, 2008 |
203285 | Thermal cycling reliability of Cu/SnAg double-bump flip chip assemblies for 100 mu m pitch applications Son, Ho-Young; Kim, Ilho; Lee, Soon-Bok; Jung, Gi-Jo; Park, Byung-Jin; Paik, Kyung-Wook, JOURNAL OF APPLIED PHYSICS, v.105, no.1, 2009-01 |
203286 | Thermal cycling reliability of Cu/SnAg double-bump flip-chip assemblies for 100um pitch applications Son, HY; Kim, IH; Lee, Soon-Bok; Jung, GJ; Park, BJ; Paik, KW, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 2007-11-19 |
203287 | Thermal cycling 열처리 가 AISI 4330강 의 현미경조직 과 기계적성질 에 미치는 효과 에 대한 연구 J.S. Chun, JOURNAL OF THE KOREAN INSTITUTE OF METALS, v.19, no.3, pp.208 - 217, 1981 |
203288 | Thermal cycling 열처리가 A.I.S.I. 4340강의 피로 균열 성장에 미치는 영향 = Effect of thermal cycling heat treatment on fatigue crack growth in A.I.S.I. 4340 steellink 이형근; Lee, Hyung-Geun; et al, 한국과학기술원, 1981 |
203289 | Thermal cycling 이 $MmNi_{4.5}Al_{0.5}$ 및 $MmNi_{4.15}Fe_{0.85}$의 수소화 반응 특성에 미치는 영향에 관한 연구 = A study on the changes of hydrogenation properties induced by thermal cyclings in $MmNi_{4.5}Al_{0.5}$ and $MmNi_{4.15}Fe_{0.85}$link 김근홍; Kim, Geun-Hong; 이재영; 이채우; et al, 한국과학기술원, 1986 |
203290 | Thermal deactivation of MgCl2/THF/TiCl4 bimetallic complex catalyst in ethylene polymerization Choi, HG; Woo, Seong-Ihl, 2nd EurAsia Conf. on Chemistry, pp.391 - 392, 1990 |
203291 | Thermal decomposition and deformation of dye and polycarbonate in compact disc-recordables Huh, YJ; Kim, SH; Kim, Sung Chul, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.36, no.12A, pp.7233 - 7238, 1997-12 |
203292 | Thermal Decomposition and Spectroscopic Studies of Preheated Ammonia Borane Zhang, Junshe; Zhao, Yu; Akins, Daniel L.; Lee, Jae Woo, JOURNAL OF PHYSICAL CHEMISTRY C, v.114, no.45, pp.19529 - 19534, 2010-11 |
203293 | Thermal decomposition kinetics of ammonium uranyl carbonate Kim, E.H.; Park, J.J.; Park, J.H.; Chang, I.S.; Choi, C.S.; Kim, Sang Done, JOURNAL OF NUCLEAR MATERIALS, v.209, no.3, pp.294 - 300, 1994 |
203294 | Thermal Decomposition Kinetics of AUC 김상돈, Proc. of Korea Nuclear Energy Society Autumn Annual Meeting, 1990 |
203295 | Thermal decomposition of Ru(EtCp)2 and metallorganic chemical vapor deposition of Ruthenium thin films using Ru(EtCp)2 No, Kwangsoo; Choi, Jong Wan; Hong, Jong In; Heo, Jung Shik; Moon, Sang Heup, 203rd Meeting of The Electrochemical Society, v.0, no.0, pp.0 - 0, ECS, 2003-04-28 |
203296 | Thermal decomposition 방법을 이용한 AgCu 2원계 나노입자의 합성과 물성평가 김나래; 정인유; 조윤환; 이혁모, 대한금속재료학회 춘계학술대회, 2012-04-27 |
203297 | Thermal decomposition 방법을 이용한 Cu2O 나노입자의 합성과 밴드갭 에너지 변화측정 김나래; 정인유; 조윤환; 이혁모, 대한금속재료학회 추계 학술대회, 대한금속재료학회, 2012-10-25 |
203298 | Thermal Deformation and Decomposition of Dye and Polycarbonate in Compact Disc-Recordables. Kim, Sung Chul, Pacific Polymer Conference, 1997 |
203299 | Thermal Deformations of CSP Assembly during Temperature Cycling and Power Cycling Ham, SJ; Lee, Soon-Bok, Int. symposium on Electronic Materials and Packaging, Serial 11, pp.350 - 357, IEEE, 2000-11 |
203300 | Thermal Degradation Mechanism of PTFE Jun, HS; Woo, Seong-Ihl; Park, KY, 1987 한국고분자학회 추계학술발표회, 한국고분자학회, 1987-10 |