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Showing results 1 to 7 of 7

1
Highly enhanced mechanical properties of polypropylene-long carbon fiber composites by a combined method of coupling agent and surface modification of long carbon fiber

Cho, Seong Min; Jung, Hee-Tae, MACROMOLECULAR RESEARCH, v.22, no.10, pp.1066 - 1073, 2014-10

2
Low Temperature Flex-on-Flex Assembly Using Polyvinylidene Fluoride Nanofiber Incorporated Sn58Bi Solder Anisotropic Conductive Films and Vertical Ultrasonic Bonding

Kim, Tae-Wan; Suk, Kyung-Lim; Lee, Sang-Hoon; Paik, Kyung-Wook, JOURNAL OF NANOMATERIALS, 2013

3
Phase separation during synthesis of polyetherimide/epoxy semi-IPNs

Park, J.W.; Kim, Sung Chul, POLYMERS FOR ADVANCED TECHNOLOGIES, v.7, no.4, pp.209 - 220, 1995-08

4
Prediction of shrinkage and warpage in consideration of residual stress in integrated simulation of injection molding

Choi, DS; Im, Yong-Taek, COMPOSITE STRUCTURES, v.47, no.1-4, pp.655 - 665, 1999-12

5
Properties of polyetherimide/dicyanate semi-interpenetrating polymer network having the morphology spectrum

Kim, Yu Seung; Kim, Sung Chul, MACROMOLECULES, v.32, no.7, pp.2334 - 2341, 1999-04

6
Soldering method using longitudinal ultrasonic

Kim, Jung Ho; Lee, J; Yoo, Choong-Don, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.28, no.3, pp.493 - 498, 2005-09

7
Ultrasonic Bonding Using Anisotropic Conductive Films (ACFs) for Flip Chip Interconnection

Lee, Ki-Won; Kim, Hyoung-Joon; Yim, Myung-Jin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.32, no.4, pp.241 - 247, 2009-10

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