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Effects of Thickness and Crystallographic Orientation on Tensile Properties of Thinned Silicon Wafers Lee, Sangmin; Kim, Jae-Han; Kim, Young Suk; Ohba, Takayuki; Kim, Taek-Soo, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.2, pp.1 - 1, 2020-02 |
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