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Showing results 1 to 5 of 5

1
Analytical Approaches for Effects of Edge-Located EBG Structure With Defected Ground Structure on Cavity-Mode Resonances of Power/Ground Planes

Kim, Myunghoi; Ahn, Seungyoung, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.70, no.12, pp.5405 - 5417, 2022-12

2
Band-stop filter effect of power/ground plane on through-hole signal via in multilayer PCB

Pak, JS; Aoyagi, M; Kikuchi, K; Kim, Joungho, IEICE TRANSACTIONS ON ELECTRONICS, v.E89C, pp.551 - 559, 2006-04

3
Modeling and Analysis of Simultaneous Switching Noise Effects on Jitter Characteristics of Delay Locked Loop and Serial Link in a Hierarchical System of Chip, Package and PCB = 칩, 패키지, 피씨비로 구성된 시스템에서 동시 스위칭 노이즈가 DLL과 직렬 통신 시스템의 지터 특성에 미치는 영향에 대한 모델링과 분석link

Shim, Yu-Jeong; 심유정; et al, 한국과학기술원, 2011

4
On-Chip electromagnetic bandgap structures for suppression of simultaneous switching noise cou-pling in on-chip power distribution networks = 온 칩 전력 분배망에서 동시 스위칭 잡음 간섭을 억제하기 위한 온 칩 전자 밴드갭 구조들link

Hwang, Chul-Soon; 황철순; et al, 한국과학기술원, 2012

5
Through-Silicon-Via-Based Decoupling Capacitor Stacked Chip in 3-D-ICs

Song, Eun-Seok; Koo, Kyoung-Choul; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.9, pp.1467 - 1480, 2013-09

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