Browse by Subject copper

Showing results 1 to 60 of 65

1
1.Synthetic studies on voglibose 2.Copper-mediated cross-coupling approach for the synthesis of heteroaryl quinolones 3.Development of 7-azaindole-based PI3K-Trk dual inhibitors = 1.보글리보즈의 합성에 관한 연구 2.구리 금속 하에서 Cross-Coupling 반응을 통한 헤테로고리 화합물이 치환된 퀴놀론계 유도체 합성에 관한 연구 3.7-Azaindole 구조의 PI3K-Trk 동시 저해제에 관한 연구link

Shin, Sang-Hye; 신상혜; et al, 한국과학기술원, 2014

2
A Facile One-Pot Synthesis and Enhanced Formic Acid Oxidation of Monodisperse Pd-Cu Nanocatalysts

Park, Kyu-Hwan; Lee, Young-Wook; Kang, Shin-Wook; Han, Sang Woo, CHEMISTRY-AN ASIAN JOURNAL, v.6, no.6, pp.1515 - 1519, 2011-06

3
A study of the hydrostatic extrusion of copper-clad aluminium tube

Park, HJ; Na, KH; Cho, NS; Lee, YS; Kim, Seung-Woo, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, v.67, no.1-3, pp.24 - 28, 1997-05

4
Adsorption and chemical reaction of Cu(hfac)(vtms) on CU(111)

Chung, YS; Lee, HS; Lee, Yoon Sup; Kim, Sehun, SURFACE SCIENCE, v.482, pp.312 - 317, 2001-06

5
Bi2O3 as a Promoter for Cu/TiO2 Photocatalysts for the Selective Conversion of Carbon Dioxide into Methane

Sunil, Jeong; Kim, Whi Dong; Lee, Sooho; Lee, Kangha; Lee, Seokwon; Lee, Dongkyu; Lee, Doh Chang, CHEMCATCHEM, v.8, no.9, pp.1641 - 1645, 2016-05

6
Bottom-up fill of submicron features in catalyst-enhanced chemical vapor deposition of copper = 촉매처리에 의한 Cu CECVD의 Bottom-up fill 현상에 관한 연구link

Shim, Kew-Chan; 심규찬; et al, 한국과학기술원, 2001

7
Cellular Automata Modeling of Grain Coarsening and Refinement during the Dynamic Recrystallization of Pure Copper

Lee, Ho Won; Im, Yong-Taek, MATERIALS TRANSACTIONS, v.51, no.9, pp.1614 - 1620, 2010-09

8
Characterization of copper interactions with Alzheimer amyloid beta peptides: Identification of an attomolar-affinity copper binding site on amyloid beta 1-42

Atwood, Craig S.; Scarpa, Richard C.; Huang, Xudong; Moir, Robert D.; Jones, Walton D; Fairlie, David P.; Tanzi, Rudolph E.; et al, JOURNAL OF NEUROCHEMISTRY, v.75, no.3, pp.1219 - 1233, 2000-09

9
Co-sputter deposited Ta-Si diffusion barrier between Si and Cu: the effects of Si content on the barrier property

Lee, YJ; Suh, BS; Park, Chong-Ook, THIN SOLID FILMS, v.357, no.2, pp.237 - 241, 1999-12

10
CO2-Reductive, Copper Oxide-Based Photobiocathode for Z-Scheme Semi-Artificial Leaf Structure

Kuk, Su Keun; Jang, Jinha; Kim, Jinhyun; Lee, Youngjun; Kim, Young Sin; Koo, Bonhyeong; Lee, Yang Woo; et al, CHEMSUSCHEM, v.13, no.11, pp.2940 - 2944, 2020-06

11
Copper-catalyzed synthesis of N-sulfonyl-1,2,3-triazoles: Controlling selectivity

Yoo, Eun Jeong; Ahlquist, Marten; Kim, Seok Hwan; Bae, Imhyuck; Fokin, Valery V.; Sharpless, K. Barry; Chang, Sukbok, ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, v.46, no.10, pp.1730 - 1733, 2007

12
[Cu(NHC)]-Catalyzed C-H Allylation and Alkenylation of both Electron-Deficient and Electron-Rich (Hetero)arenes with Allyl Halides

Xie, Weilong; Chang, Sukbok, ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, v.55, no.5, pp.1876 - 1880, 2016-01

13
Design of small molecules that target metal-A beta species and regulate metal-induced A beta aggregation and neurotoxicity

Choi, Jung-Suk; Braymer, Joseph J.; Nanga, Ravi P. R.; Ramamoorthy, Ayyalusamy; Lim, Mi Hee, PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA, v.107, no.51, pp.21990 - 21995, 2010-12

14
Direct Stereoconvergent Allylation of Chiral Alkylcopper Nucleophiles with Racemic Allylic Phosphates

Han, Jung Tae; Kim, Seoung-Tae; Baik, Mu-Hyun; Yun, Jaesook, CHEMISTRY-A EUROPEAN JOURNAL, v.26, no.12, pp.2592 - 2596, 2020-02

15
Dopamine and Cu+/(2+) Can Induce Oligomerization of alpha-Synuclein in the Absence of Oxygen: Two Types of Oligomerization Mechanisms for alpha-Synuclein and Related Cell Toxicity Studies

Ha, Yong Hwang; Yang, Aerin; Lee, Seyoung; Kim, Kibong; Liew, Hyunjeong; Lee, Sang Hyung; Lee, Ju Eun; et al, JOURNAL OF NEUROSCIENCE RESEARCH, v.92, no.3, pp.359 - 368, 2014-03

16
Effect of ion-beam assisted deposition on resistivity and crystallographic structure of Cr/Cu

Jung, Yang-Il; Lee, Jung-Suk; Park, Jeong-Yong; Jeong, Yong-Hwan; Moon, Kyoung Seok; Kim, Kyoung-Sun, ELECTRONIC MATERIALS LETTERS, v.5, no.3, pp.105 - 107, 2009

17
Effect of metal ions on the stability of metallothionein in the degradation by cellular fractions in vitro

Hahn, SH; Yoo, Ook-Joon; Gahl, WA, EXPERIMENTAL AND MOLECULAR MEDICINE, v.33, no.1, pp.32 - 36, 2001-03

18
Effect of the pressure on the chemical vapor deposition of copper from copper hexafluoroacetylacetonate trimethylvinylsilane

Lee, WJ; Rha, SY; Lee, SY; Kim, DW; Park, Chong-Ook, THIN SOLID FILMS, v.305, pp.254 - 258, 1997-01

19
Effect of Water Vapor on Oxidation Processes of the Cu(111) Surface and Sublayer

Kim, Young Jae; Kim, Daeho; Kim, Yongman; Jeong, Yongchan; Jeong, Beomgyun; Park, Jeong Young, INTERNATIONAL JOURNAL OF MOLECULAR SCIENCES, v.24, no.1, 2023-01

20
Effective Electroregeneration of the Oxidized Iron(II) Thiochelate Absorbent in the Wet NOX Absorption Process

Cheon, Seonjeong; Lee, Ju Yong; Kim, Sun Hyung; Yoon, Hyung Chul; Han, Jong-In, ACS ES&T ENGINEERING, v.2, no.7, pp.1287 - 1295, 2022-07

21
Effects of Substrate Morphology and Postelectrodeposition on Structure of Cu Foam and Their Application for Li-Ion Batteries

Kim, Ryoung-Hee; Han, Dong-Wook; Nam, Do-Hwan; Kim, Jeong-Han; Kwon, Hyuk-Sang, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.157, no.5, pp.269 - 273, 2010

22
Effects of the annealing in Ar and H-2/Ar ambients on the microstructure and the electrical resistivity of the copper film prepared by chemical vapor deposition

Rha, SK; Lee, WJ; Lee, SY; Kim, DW; Park, Chong-Ook; Chun , Soung Soon, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.35, no.11, pp.5781 - 5786, 1996-11

23
Effects of the partial pressure of copper (I) hexafluoroacetylacetonate trimethylvinylsilane on the chemical vapor deposition of copper

Lee, SY; Rha, SK; Lee, WJ; Kim, DW; Hwang, JS; Park, Chong-Ook, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.36, pp.5249 - 5252, 1997-01

24
Electrochemical nucleation and growth of copper on chromium-plated electrodes

Kim, SB; Kim, KT; Park, CJ; Kwon, Hyuk-Sang, JOURNAL OF APPLIED ELECTROCHEMISTRY, v.32, pp.1247 - 1255, 2002-11

25
Electroless deposition of copper for metallization in ULSI = 초고집적회로(ULSI)의 금속화공정을 위한 구리 무전해 도금link

Nam, Kwang-Yong; 남광용; et al, 한국과학기술원, 2001

26
Enhancement of nitrous oxide emissions in soil microbial consortia via copper competition between proteobacterial methanotrophs and denitrifiers

Chang, Jin; Kim, Daehyun; Semrau, Jeremy D.; Lee, Juyong; Heo, Hokwan; Gu, Wenyu; Yoon, Sukhwan, APPLIED AND ENVIRONMENTAL MICROBIOLOGY, v.87, no.5, pp.e02301 - 20, 2021-03

27
Enzyme-Free Colorimetric Detection of Cu2+ by Utilizing Target-Triggered DNAzymes and Toehold-Mediated DNA Strand Displacement Events

Park, Yeonkyung; Lee, Chang Yeol; Park, Ki Soo; Park, Hyun Gyu, CHEMISTRY-A EUROPEAN JOURNAL, v.23, no.68, pp.17379 - 17383, 2017-12

28
Feasibility of micellar-enhanced ultrafiltration (MEUF) for the heavy metal removal in soil washing effluent

Jung, Juri; Yang, Jung-Seok; Kim, Seong-Hye; Yang, Ji-Won, DESALINATION, v.222, no.1-3, pp.202 - 211, 2008-03

29
Hardness and wear resistance of carbon nanotube reinforced Cu matrix nanocomposites

Kim, KT; Cha, S; Hong, Soon-Hyung, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.449, pp.46 - 50, 2007-03

30
Highly Efficient and Reusable Copper-Catalyzed N-Arylation of Nitrogen-Containing Heterocycles with Aryl Halides

Lee, HJ; Kang, H; Yang, H; Park, KH; Kim, AY; Lee, HJ; Park, JC; et al, MOLECULES, v.14, no.12, pp.5169 - 5178, 2009-12

31
Highly Efficient Ultrafast Electron Injection from the Singlet MLCT Excited State of Copper(I) Diimine Complexes to TiO2 Nanoparticles

Huang, Jier; Buyukcakir, Onur; Mara, Michael W.; Coskun, Ali; Dimitrijevic, Nada M.; Barin, Gokhan; Kokhan, Oleksandr; et al, ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, v.51, no.51, pp.12711 - 12715, 2012

32
Improvement of Device Performance by Optimizing the Advanced DCV Process Condition in Dual-Damascene Cu Interconnects

Lee, Min Hyung; Lee, Han Choon; Park, Chul Ho; Han, Jae-Won; Paik, Kyung-Wook, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.156, no.8, pp.644 - 647, 2009-06

33
Influence of Cu on the Passivation Behavior of Fe-20Cr-xCu (x=0, 2, 4 wt%) Alloys in Sulfuric Acid Solution

Oh, Kkoch-Nim; Toor, Ihsan-ul-Haq; Ahn, Soo-Hoon; Kwon, Hyuk-Sang, CORROSION, v.69, no.6, pp.560 - 567, 2013-06

34
Influence of electron donor and toxic materials on the activity of sulfate reducing bacteria for the treatment of electroplating wastewater

Song, Yong-Chae; Paik, Byeong-Cheon; Shin, Hang-Sik; Lee, Sung-Jin, WATER SCIENCE AND TECHNOLOGY, v.38, no.4-5, pp.187 - 194, 1998

35
Intimate atomic Cu-Ag interfaces for high CO2RR selectivity towards CH4 at low over potential

Choi, Chungseok; Cai, Jin; Lee, Changsoo; Lee, Hyuck Mo; Xu, Mingjie; Huang, Yu, NANO RESEARCH, v.14, no.10, pp.3497 - 3501, 2021-10

36
Kinetic model for cavity filling in CECVD of copper = 촉매 처리에 의한 구리 CECVD의 cavity filling 현상에 관한 모델link

Lee, Hyun-Bae; 이현배; et al, 한국과학기술원, 2005

37
Low-Temperature Plasma Etching of Copper Films Using Ultraviolet Irradiation

Kang-Sik Choi; Chul-Hi Han, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1, v.37, no.11, pp.5945 - 5948, 1998-11

38
Mechanistic approaches for chemically modifying the coordination sphere of copper-amyloid-beta complexes

Han, Jiyeon; Lee, Hyuck Jin; Kim, Kyu Yeon; Nam, Geewoo; Chae, Junghyun; Lim, Mi Hee, PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA, v.117, no.10, pp.5160 - 5167, 2020-03

39
Metals and methanotrophy

Semrau, Jeremy D.; DiSpirito, Alan A.; Gu, Wenyu; Yoon, Sukhwan, APPLIED AND ENVIRONMENTAL MICROBIOLOGY, v.84, no.6, 2018-03

40
Migration and reduction of formate to form methanol on Cu/ZnO catalysts

Joo, OS; Jung, KD; Han, SH; Uhm, SJ; Lee, DK; Ihm, Son Ki, APPLIED CATALYSIS A-GENERAL, v.135, no.2, pp.273 - 286, 1996-02

41
Modeling of copper ion removal from aqueous solutions using modified silica beads

Lee, Hyunjoo; Kim, Jongsung; Yi, Jongheop, CHEMICAL ENGINEERING COMMUNICATIONS, v.181, pp.37 - 55, 2000

42
N,N-Dimethylformamide-Assisted Shape Evolution of Highly Uniform and Shape-Pure Colloidal Copper Nanocrystals

Lee, Da Won; Woo, Ho Young; Lee, Dong Hyun David; Jung, Myung-Chul; Lee, Donguk; Lee, MinJi; Kim, Jong Bae; et al, SMALL, v.17, no.40, 2021-10

43
Nucleation reactions and film growth of copper on TiN using hexafluoroacetylacetonate copper(I) trimethylvinylsilane

Kim, DH; Lee, YJ; Park, Chong-Ook; Park, JW; Kim, JJ, CHEMICAL ENGINEERING COMMUNICATIONS, v.153, pp.307 - 317, 1996-06

44
One-Pot Synthesis of CeO2-Supported Pd-Cu-Alloy Nanocubes with High Catalytic Activity

Park, Kyu-Hwan; Lee, Young Wook; Kim, Yena; Kang, Shin-Wook; Han, Sang Woo, CHEMISTRY-A EUROPEAN JOURNAL, v.19, no.25, pp.8053 - 8057, 2013-06

45
Oxidation, grain growth and reflow characteristics of copper thin films prepared by chemical vapor deposition

Lee, SY; Choi, SH; Park, Chong-Ook, THIN SOLID FILMS, v.359, no.2, pp.261 - 267, 2000-01

46
Oxidative degradation of trichloroethylene, pyrene, and toluene by fenton-like reaction using nano-scale zero-valent iron and pyrite = 영가철 및 황철석을 이용하는 유사펜톤반응에 의한 trichloroethylene, pyrene, toluene의 산화적 분해link

Choi, Kyung-Hoon; 최경훈; et al, 한국과학기술원, 2014

47
Passivation of Metal Surface States: Microscopic Origin for Uniform Mono layer Graphene by Low Temperature Chemical Vapor Deposition

Jeon, Insu; Yang, Heejun; Lee, Sung-Hoon; Heo, Jinseong; Seo, David H.; Shin, Jaikwang; Chung, U-In; et al, ACS NANO, v.5, no.3, pp.1915 - 1920, 2011-03

48
Plasmon-enhanced photocatalytic hydrogen production over visible-light responsive Cu/TiO2

Kum, Jong-Min; Park, Yang Jeong; Kim, Hyun-Jin; Cho, Sung-Oh, NANOTECHNOLOGY, v.26, no.12, 2015-03

49
Predispersed solvent extraction of negatively complexed copper from water using colloidal liquid aphron containing a quaternary ammonium salt

Hahm, HC; Lee, DW; Hong, Won-Hi; Lee, Tai-Yong; Lee, CH, KOREAN JOURNAL OF CHEMICAL ENGINEERING, v.20, no.4, pp.716 - 723, 2003-07

50
Properties of reactively sputtered WNx as Cu diffusion barrier

Suh, BS; Lee, YJ; Hwang, JS; Park, Chong-Ook, THIN SOLID FILMS, v.348, no.1-2, pp.299 - 303, 1999-07

51
Rate-accelerated nonconventional amide synthesis in water: A practical catalytic aldol-surrogate reaction

Cho, Seung-Hwan; Chang, Suk-Bok, ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, v.46, no.11, pp.1897 - 1900, 2007

52
Reaction characteristics between Cu thin film and RF inductively coupled Cl-2 plasma without/with UV irradiation

Kwon, MS; Lee, JeongYong; Choi, KS; Han, CH, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.37, no.7, pp.4103 - 4108, 1998-07

53
Reactive ion etching mechanism of copper film in chlorine-based electron cyclotron resonance plasma

Lee, SK; Chun , Soung Soon; Hwang, CY; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.36, no.1A, pp.50 - 55, 1997-01

54
Removal of Cu(Ⅱ) from water using colloidal liquid aphrons containing amine extractants = 아민 추출제를 포함하는 콜로이드 액상 에이프런을 사용하여 물로부터 구리 이온의 제거link

Hahm, Hyung-Chul; 함형철; et al, 한국과학기술원, 2002

55
Residual stress effect on self-annealing of electroplated copper

Lee, CH; Park, Chong-Ook, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.42, no.7, pp.4484 - 4488, 2003-07

56
Residual stress-driven test technique for freestanding ultrathin films: Elastic behavior and residual strain

Cuddalorepatta, Gayatri K.; Sim, Gi-Dong; Li, Han; Pantuso, Daniel; Vlassak, Joost J., JOURNAL OF MATERIALS RESEARCH, v.34, no.20, pp.3474 - 3482, 2019-10

57
Room temperature copper-catalyzed 2-functionalization of pyrrole rings by a three-component coupling reaction

Cho, Seung-Hwan; Chang, Suk-Bok, ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, v.47, no.15, pp.2836 - 2839, 2008

58
Room-temperature growth of Cu thin films by nozzle-type partially ionized beam deposition with various acceleration voltages

Koh, SK; Yoon, YS; Kim, KH; Jung, HJ; Lee, JeongYong, THIN SOLID FILMS, v.278, no.1-2, pp.45 - 48, 1996-05

59
Sulfonyl and Phosphoryl Azides: Going Further Beyond the Click Realm of Alkyl and Aryl Azides

Kim, Seok-Hwan; Park, Sae-Hume; Choi, Ji-Ho; Chang, Suk-Bok, CHEMISTRY-AN ASIAN JOURNAL, v.6, no.10, pp.2618 - 2634, 2011-10

60
Switching Chemoselectivity Based on the Ring Size: How to Make Ring-Fused Indoles Using Transition-Metal-Mediated Cross-Coupling

Kim, Jang-Yeop; Lee, Woojong; Kang, Hyung-Joon; Jeon, Tae-Hong; Baik, Mu-Hyun; Cho, Cheon-Gyu, ACS CATALYSIS, v.11, no.20, pp.12821 - 12832, 2021-10

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