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Showing results 1 to 6 of 6

1
An Improved 100 GHz Equivalent Circuit Model of a Through Silicon Via With Substrate Current Loop

Kim, Kibeom; Hwang, Karam; Ahn, Seungyoung, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.26, no.6, pp.425 - 427, 2016-06

2
Equivalent Circuit Modeling of Dielectric Hysteresis Loops in Through Silicon Vias

Piersanti, Stefano; De Paulis, Francesco; Orlandi, Antonio; Kim, Dong-Hyun; Kim, Joungho; Fan, Jun, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.57, no.6, pp.1510 - 1516, 2015-12

3
High-Frequency Modeling and Signal Integrity Analysis of a Silicone Rubber Socket for High-Performance Package

Kim, Hyesoo; Kim, Jonghoon J.; Park, Junyong; Park, Shinyoung; Choi, Sumin; Bae, Bumhee; Ha, DongHo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1356 - 1368, 2017-08

4
Modeling and Analysis of TSV Noise Coupling Effects on RF LC-VCO and Shielding Structures in 3D IC

Lim, Jaemin; Cho, Jonghyun; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Choi, Sumin; Kim, Dong-Hyun; Lee, Man Ho; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.60, no.6, pp.1939 - 1947, 2018-12

5
Non-destructive micro-Raman analysis of Si near Cu through silicon via

Kim, Jae Hyun; Yoo, Woo Sik; Han, Seung Min, ELECTRONIC MATERIALS LETTERS, v.13, no.2, pp.120 - 128, 2017-03

6
Optimization of deep reactive ion etching for microscale silicon hole arrays with high aspect ratio

Kim, Taeyeong; Lee, Jungchul, MICRO AND NANO SYSTEMS LETTERS, v.10, no.1, 2022-09

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