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Development of single cantilever beam method to measure the adhesion of thin film adhesive on silicon chip Shin, DongKil; Lee, Jung-Ju; Yoon, ChulKeun; Lee, GyuJei; Hong, JoonKi; Kim, NamSuk, ENGINEERING FRACTURE MECHANICS, v.133, pp.179 - 190, 2015-01 |
Evaluation of Analysis Conditions for Laser-Pulsed Atom Probe Tomography: Example of Cemented Tungsten Carbide Peng, Zirong; Choi, Pyuck-Pa; Gault, Baptiste; Raabe, Dierk, MICROSCOPY AND MICROANALYSIS, v.23, no.2, pp.431 - 442, 2017-04 |
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