A method to measure the tensile adhesion of thin films on a silicon chip was developed. A new test machine was designed to obtain tensile adhesion by applying a single cantilever beam method. Self-alignment of the specimen was accomplished by a specially designed jig and mount. The specimen was designed to allow fabrication by using a commercial manufacturing process. The developed method was applied to measure the adhesion of die attach films having various thicknesses ranging from 5 mu m to 20 mu m. Adhesion between the film adhesive and the top surface of a silicon chip was successfully measured. It was shown that the measured adhesion was independent of crack length and robust against variation of the initial alignment of specimen.