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Showing results 1 to 6 of 6

1
(A) study on the mechanical reliability of solder joints in electronic packaging = 전자 패키지 소더 조인트의 기계적 신뢰성에 관한 연구link

Ham, Suk-Jin; 함석진; et al, 한국과학기술원, 2002

2
Formal synthesis of application and platform behaviors of embedded software systems

Kim, Jinhyun; Kang, Inhye; Choi, Jin-Young; Lee, Insup; Kang, Sungwon, SOFTWARE AND SYSTEMS MODELING, v.14, no.2, pp.839 - 859, 2015-05

3
Microwave frequency crosstalk model of redistribution line patterns on wafer level package

Sung, M.; Kim, N.; Lee, J.; Kim, H.; Choi, B.K.; Kim, J.-M.; Hong, J.-K.; et al, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.25, no.2, pp.265 - 271, 2002-05

4
New time-scale criteria for model simplification of bio-reaction systems

Choi, JW; Yang, KW; Lee, TY; Lee, SangYup, BMC BIOINFORMATICS, v.9, pp.1 - 8, 2008-08

5
Power cycling하에서의 웨이퍼 레벨 CSP assembly의 열변형에 관한 연구 = A study on the thermal deformations of wafer-level CSP assembly under power cyclinglink

조만석; Cho, Man-Seok; et al, 한국과학기술원, 2001

6
Reduction of CO2 emission for solar power backup by direct integration of oxy-combustion supercritical CO2 power cycle with concentrated solar power

Son, Seongmin; Heo, Jin Young; Kim, Nam Il; Jamal, Aqil; Lee, Jeong-Ik, ENERGY CONVERSION AND MANAGEMENT, v.201, no.1, 2019-12

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