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Showing results 1 to 4 of 4

1
Characterization of pit morphology of sputtered Al-1wt%Si-0.5wt%Cu alloy thin film

Orr, SJ; Pyun, Su Il; Nam, SW, THIN SOLID FILMS, v.279, no.1-2, pp.7 - 10, 1996-06

2
Effects of residual S on Kirkendall void formation at Cu/Sn-3.5Ag solder joints

Yu, Jin; Kim, J. Y., ACTA MATERIALIA, v.56, no.19, pp.5514 - 5523, 2008-11

3
Effects of sulfide-forming element additions on the Kirkendall void formation and drop impact reliability of Cu/Sn-3.5Ag solder joints

Kim, J. Y.; Yu, Jin; Kim, Sung-Hwan, ACTA MATERIALIA, v.57, pp.5001 - 5012, 2009-10

4
Fe addition to Sn-3.5Ag solder for the suppression of Kirkendall void formation

Kim, Sung-Hwan; Yu, Jin, SCRIPTA MATERIALIA, v.69, no.3, pp.254 - 257, 2013-08

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