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Showing results 6 to 7 of 7

6
Signal Integrity Analysis of Through-Silicon Via (TSV) With a Silicon Dioxide Well to Reduce Leakage Current for High-Bandwidth Memory Interface

Kim, Hyunwoong; Lee, Seonghi; Park, Jongcheol; Shin, Yujun; Woo, Seongho; Kim, Jongwook; Cho, Jaeyong; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.13, no.5, pp.700 - 714, 2023-05

7
Spiral inductors fabricated on multi-layered Bragg reflector for Si-based RF IC applications

Mai, L; Song, HI; Tuan, LM; Van Su, P; Yoon, Giwan, MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.48, pp.1296 - 1298, 2006-07

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