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Showing results 31 to 41 of 41

31
Removal of Pb and Cu ions from aqueous solution by Mn3O4-coated activated carbon

Lee, Myoung-Eun; Park, Jin Hee; Chung, Jae Woo; Lee, Chae-Young; Kang, Seoktae, JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY, v.21, pp.470 - 475, 2015-01

32
Research on fabrication process & mechanical behavior of CNT/Cu & CNT/Ni nanocomposite = 탄소나노튜브/Cu 및 탄소나노튜브/Ni 나노복합재료의 제조 공정 및 기계적 거동 연구link

Lim, Byung Kyu; 임병규; Jeon, Seok Woo; 전석우; et al, 한국과학기술원, 2012

33
Shape effect of ceria in Cu/ceria catalysts for preferential CO oxidation

Han, Jaeman; Kim, Hyung Jun; Yoon, Sangwoon; Lee, Hyunjoo, JOURNAL OF MOLECULAR CATALYSIS A-CHEMICAL, v.335, no.1-2, pp.82 - 88, 2011-02

34
Studies on the formation of C-C and C-N bonds using late transition metal catalysts = 후전이금속 촉매를 이용한 탄소-탄소, 탄소-질소 형성반응에 관한 연구link

Cho, Seung-Hwan; 조승환; et al, 한국과학기술원, 2011

35
Supramolecular magnetic materials of transition metal : synthesis, structure and characterization = 전이금속 초분자 자성물질: 합성, 구조 및 특성 연구link

Kim, Do-Hyeon; 김도현; et al, 한국과학기술원, 2005

36
Thermal design of the conduction-cooled high temperature superconducting magnet for pulsating magnetic field

Kwon, Dohoon; Kim, Bokeum; Choi, Jongho; Jeong, Sangkwon; Kim, Seokho, IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, v.33, no.5, 2023-08

37
고이동도 비정질 산화물 반도체 박막 트랜지스터용 소스-드레인 전극 물질과 구리 확산 방지 특성에 대한 연구 = A study on source-drain electrode material for high-mobility oxide thin-film transistors and its copper diffusion barrier propertylink

이광흠; Lee, Kwang-Heum; et al, 한국과학기술원, 2016

38
구리 CECVD를 이용한 3-D packaging용 through-Si via/trench filling에 대한 연구 = Through-Si via/trench filling for 3-D packaging by copper catalyst-enhanced chemical vapor depositionlink

이도선; Lee, Do-Seon; et al, 한국과학기술원, 2009

39
구리의 화학증착기구에 관한 연구 = A study on the copper chemical vapor deposition mechanism using copper(I) hexafluoroacetylacetonate trimethylvinylsilanelink

이원준; Lee, Won-Jun; et al, 한국과학기술원, 1996

40
반도체 배선용 구리 전기도금막의 Self-annealing 기구분석 = Analysis of self-annealing mechanism in electroplated Cu thin film for the interconnect of semiconductor deviceslink

이창희; Lee, Chang-Hee; et al, 한국과학기술원, 2003

41
염소계 플라즈마를 이용한 구리박막의 건식 식각기구에 관한 연구 = A study on the dry etching mechanism of copper film in chlorine-based plasmalink

이성권; Lee, Sung-Kwon; et al, 한국과학기술원, 1997

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