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Showing results 71 to 88 of 88

71	Quantitative analysis of the bit size dependence on the pulse width and pulse voltage in ferroelectric memory devices using atomic force microscopy Woo, J; Hong, Daniel Seungbum; Setter, N; Shin, H; Jeon, JU; Pak, YE; No, Kwangsoo, JOURNAL OF VACUUM SCIENCE TECHNOLOGY B, v.19, no.3, pp.818 - 824, 2001
72	Real World Application of Angular Scan Pulse-Echo Ultrasonic Propagation Imager for Damage Tolerance Evaluation of Full-Scale Composite Fuselage Lee, WJ; Seo, BH; Hong, Seung-Chan; Won, MS; Lee, Jung-Ryul, STRUCTURAL HEALTH MONITORING-AN INTERNATIONAL JOURNAL, v.18, no.5-6, pp.1943 - 1952, 2019-11
73	Relaxation of remanent polarization in Pb(ZrTi)O-3 thin film capacitors Lee, KW; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.41, pp.6718 - 6723, 2002-11
74	Safety of professional drivers in an ageing society - A driving simulator study Chen, Tiantian; Sze, N. N.; Bai, Lu, TRANSPORTATION RESEARCH PART F-TRAFFIC PSYCHOLOGY AND BEHAVIOUR, v.67, pp.101 - 112, 2019-11
75	Stability and read/write characteristics of nano ferroelectric domains No, Kwangsoo; Song, HW; Hong, J; Woo, J; Shin, H; Hong, Daniel Seungbum, FERROELECTRICS, v.259, no.1-4, pp.289 - 298, 2001
76	Study on interaction-induced symptoms with respect to virtual grasping and manipulation Kim, Yongwan; Park, Jinah, INTERNATIONAL JOURNAL OF HUMAN-COMPUTER STUDIES, v.72, pp.141 - 153, 2014-02
77	Surface Electromyography Characteristics for Motion Intention Recognition and Implementation Issues in Lower-limb Exoskeletons Kyeong, Seulki; Feng, Jirou; Ryu, Jae Kwan; Park, Jung Jae; Lee, Kyeong Ha; Kim, Jung, INTERNATIONAL JOURNAL OF CONTROL AUTOMATION AND SYSTEMS, v.20, no.3, pp.1018 - 1028, 2022-03
78	Tailoring of the coercive voltage in a ferroelectric polymer capacitor Kim, Woo-Young; Lee, Hee Chul, MICROELECTRONIC ENGINEERING, v.166, pp.19 - 25, 2016-12
79	Temperature-Controlled Direct Imprinting of Ag Ionic Ink: Flexible Metal Grid Transparent Conductors with Enhanced Electromechanical Durability Oh, Yong Suk; Choi, Hyesun; Lee, Jaeho; Lee, Hyunwoo; Choi, Dong Yun; Lee, Sung Uk; Yun, Kyeong-Soo; et al, SCIENTIFIC REPORTS, v.7, 2017-09
80	The effect of grain boundary phase on contact damage resistance of alumina ceramics Kim, JH; Lee, S; Lee, KS; Kim, Do Kyung, JOURNAL OF MATERIALS SCIENCE, v.39, pp.7023 - 7030, 2004-12
81	The influence of an extrinsic interfacial layer on the polarization of sputtered BaTiO3 film Cho, YW; Choi, Si-Kyung; Rao, GV, APPLIED PHYSICS LETTERS, v.86, no.20, pp.40 - +, 2005-05
82	The low temperature processing for removal of metallic bismuth in ferroelectric SrBi2Ta2O9 thin films Kim, Ho Gi, APPLIED SURFACE SCIENCE, v.140, no.1-2, pp.150 - 155, 1999-01
83	The Occurrence of Grain Boundary Serration and Its Effect on the Character of M23C6 Carbides in an AISI 316 Stainless Steel h. u. hong; Nam, Soo Woo, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.332, no.1-2, pp.255 - 261, 2002
84	THE TORQUE TRANSMISSION CAPABILITIES OF THE ADHESIVELY-BONDED TUBULAR SINGLE LAP JOINT AND THE DOUBLE LAP JOINT CHOI, JH; Lee, Dai Gil, JOURNAL OF ADHESION, v.44, no.3, pp.197 - 212, 1994
85	Towards a Physiology-Based Measure of Visual Discomfort: Brain Activity Measurement While Viewing Stereoscopic Images With Different Screen Disparities Jung, Yong Ju; Kim, Dongchan; Sohn, Hosik; Lee, Seong-il; Park, Hyun Wook; Ro, Yong Man, JOURNAL OF DISPLAY TECHNOLOGY, v.11, no.9, pp.730 - 743, 2015-09
86	Visual comfort assessment metric based on salient object motion information in stereoscopic video Jung, Yong Ju; Lee, Seong-il; Sohn, Hosik; Park, Hyun Wook; Ro, Yong Man, JOURNAL OF ELECTRONIC IMAGING, v.21, no.1, 2012-01
87	복합재료 샌드위치 구조용 기계적 접합부의 피로 및 충격 특성에 관한 연구 = A study on the fatigue and impact characteristics of the mechanical joints for composite sandwich structures link 임태성; Lim, Tae-Seong; et al, 한국과학기술원, 2004
88	전자패키지 Ball grid array 소더 조인트의 기계적 피로 특성에 관한 연구 = A study on mechanical fatigue behaviors of ball grid array solder joints for electronic packaging link 박태상; Park, Tae-Sang; et al, 한국과학기술원, 2004

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