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Showing results 4 to 7 of 7

4
Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects

Kim, Ki-Yeong; Hwang, Chul-Soon; Koo, Kyoung-Choul; Cho, Jong-Hyun; Kim, Hee-Gon; Kim, Joung-Ho; Lee, Jun-Ho; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.12, pp.2057 - 2070, 2012-12

5
Monolithic implementation of coaxial line on silicon substrate

Jeong, In Ho; Kwon, Young-Se, IEEE MICROWAVE AND GUIDED WAVE LETTERS, v.10, no.10, pp.406 - 408, 2000-10

6
Signal Integrity Analysis of Through-Silicon Via (TSV) With a Silicon Dioxide Well to Reduce Leakage Current for High-Bandwidth Memory Interface

Kim, Hyunwoong; Lee, Seonghi; Park, Jongcheol; Shin, Yujun; Woo, Seongho; Kim, Jongwook; Cho, Jaeyong; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.13, no.5, pp.700 - 714, 2023-05

7
Spiral inductors fabricated on multi-layered Bragg reflector for Si-based RF IC applications

Mai, L; Song, HI; Tuan, LM; Van Su, P; Yoon, Giwan, MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.48, pp.1296 - 1298, 2006-07

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