Browse by Subject DELAMINATION
Showing results 20 to 34 of 34
| Laser active thermography for debonding detection in FRP retrofitted concrete structures Xu, Ying; Hwang, Soonkyu; Wang, Qingyuan; Kim, Donggun; Luo, Congcong; Yang, Jinyeol; Sohn, Hoon, NDT & E INTERNATIONAL, v.114, 2020-09 |
| Low-Velocity Impact and Residual Burst-Pressure Analysis of Cylindrical Composite Pressure Vessels Kim, Eun-Ho; Lee, In; Hwang, Tae-Kyung, AIAA JOURNAL, v.50, no.10, pp.2180 - 2193, 2012-10 |
| Modeling of a Gc-sensing element for the interfacial toughness of metal thin films on substrates Jeon I.; Asahina T.; Omiya M.; Kishimoto K.; Im, Seyoung, SENSORS AND ACTUATORS A-PHYSICAL, v.122, no.2, pp.291 - 300, 2005-08 |
| Moisture Effects on NCF Adhesion and Solder Joint Reliability of Chip-on-Board Assembly Using Cu Pillar/Sn-Ag Microbump Kim, Youngsoon; Yoon, Taeshik; Kim, Tae-Wan; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.3, pp.371 - 378, 2017-03 |
| Moisture induced interface weakening in ACF package Sim, Gidong; Chung, Chang-Kyu; Paik, Kyung-Wook; Lee, Soon-Bok, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.528, no.2, pp.698 - 705, 2010-12 |
| Monitoring of impact damages in composite laminates using wavelet transform Sung, DU; Kim, Chun-Gon; Hong, Chang Sun, COMPOSITES PART B-ENGINEERING, v.33, no.1, pp.35 - 43, 2002 |
| Multifunctionality and control of the crumpling and unfolding of large-area graphene Zang, Jianfeng; Ryu, Seunghwa; Pugno, Nicola; Wang, Qiming; Tu, Qing; Buehler, Markus J.; Zhao, Xuanhe, NATURE MATERIALS, v.12, no.4, pp.321 - 325, 2013-04 |
| Nonconductive Films (NCFs) With Multifunctional Epoxies and Silica Fillers for Reliable NCFs Flip Chip on Organic Boards (FCOBs) Chung, Chang-Kyu; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.32, no.2, pp.65 - 73, 2009-04 |
| Optimum design of composite structures with ply drop using genetic algorithm and expert system shell Kim, JS; Kim, Chun-Gon; Hong, Chang Sun, COMPOSITE STRUCTURES, v.46, no.2, pp.171 - 187, 1999-10 |
| Postbuckling strength of stiffened composite plates with impact damage Kong, CW; Hong, Chang Sun; Kim, Chun-Gon, AIAA JOURNAL, v.38, no.10, pp.1956 - 1964, 2000-10 |
| Practical design of tapered composite structures using the manufacturing cost concept Kim, JS; Kim, Chun-Gon; Hong, Chang Sun, COMPOSITE STRUCTURES, v.51, no.3, pp.285 - 299, 2001-03 |
| Recent developments in the manufacturing technologies of composite components and their cost-effectiveness in the automotive industry: A review study SARFRAZ MUHAMMAD SALMAN; Hong, Hyunsoo; Kim, Seong Su, COMPOSITE STRUCTURES, v.266, 2021-06 |
| Role of Crack Deflection on Rate Dependent Mechanical Transfer of Multilayer Graphene and Its Application to Transparent Electrodes Kang, Sumin; Yoon, Taeshik; Kim, Seunghwan; Kim, Taek-Soo, ACS APPLIED NANO MATERIALS, v.2, no.4, pp.1980 - 1985, 2019-04 |
| The effects of stacking sequence on the penetration-resistant behaviors of T800 carbon fiber composite plates under low-velocity impact loading Ahmad, Furqan; Hong, Jung-Wuk; Choi, Heung Soap; Park, Soo-Jin; Park, Myung Kyun, CARBON LETTERS, v.16, no.2, pp.107 - 115, 2015-04 |
| Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition Jang, Jae-Won; Suk, Kyoung-Lim; Park, Jin-Hyoung; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.7, pp.1144 - 1151, 2014-07 |
Discover
Type
Open Access
Date issued
- 33,508 2020 - 2024
- 100,068 2010 - 2019
- 75,675 2000 - 2009
- 44,727 1990 - 1999
- 14,360 1980 - 1989
- 62 1964 - 1969