Showing results 3 to 6 of 6
Microwave frequency crosstalk model of redistribution line patterns on wafer level package Sung, M.; Kim, N.; Lee, J.; Kim, H.; Choi, B.K.; Kim, J.-M.; Hong, J.-K.; et al, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.25, no.2, pp.265 - 271, 2002-05 |
New time-scale criteria for model simplification of bio-reaction systems Choi, JW; Yang, KW; Lee, TY; Lee, SangYup, BMC BIOINFORMATICS, v.9, pp.1 - 8, 2008-08 |
Power cycling하에서의 웨이퍼 레벨 CSP assembly의 열변형에 관한 연구 = A study on the thermal deformations of wafer-level CSP assembly under power cyclinglink 조만석; Cho, Man-Seok; et al, 한국과학기술원, 2001 |
Reduction of CO2 emission for solar power backup by direct integration of oxy-combustion supercritical CO2 power cycle with concentrated solar power Son, Seongmin; Heo, Jin Young; Kim, Nam Il; Jamal, Aqil; Lee, Jeong-Ik, ENERGY CONVERSION AND MANAGEMENT, v.201, no.1, 2019-12 |
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