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Showing results 47081 to 47100 of 101366

47081
Interfacial Condensation Heat Transfer for Countercurrent Steam-Water Stratified Flow in a Circular Pipe

moon-hyun chun; in-cheol chu; moon-ki chung; seon-oh yu, KOREAN NUCLEAR SOCIETY JOURNAL, v.32, no.2, pp.142 - 156, 2000-04

47082
Interfacial crack tip field in anisotropic/isotropic bimaterials

Shin, KC; Liu, H; Lee, Jungju; Choi, ST, COMPOSITE STRUCTURES, v.66, no.1-4, pp.673 - 676, 2004-10

47083
Interfacial crack-induced debonding behavior of sprayed FRP laminate bonded to RC beams

Ha, Seong-Kug; Khalid, Hammad R.; Park, Solmoi; Lee, Haeng-Ki, COMPOSITE STRUCTURES, v.128, pp.176 - 187, 2015-09

47084
Interfacial deflection and jetting of a paramagnetic particle-laden fluid: theory and experiment

Tsai, Scott S. H.; Griffiths, Ian M.; Li, Zhenzhen; Kim, Pilnam; Stone, Howard A., SOFT MATTER, v.9, no.35, pp.8600 - 8608, 2013

47085
Interfacial Dipole Modulation Device With SiOX Switching Species

Kim, Giuk; Kim, Taeho; Jeon, Sanghun, IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY, v.9, pp.57 - 60, 2021

47086
Interfacial Effects on the Viscosity and the Morphology of a Thermotropic Liquid Crystalline Polymer

B.Y. Shin; Chung, In Jae, POLYMER BULLETIN, v.20, no.4, pp.399 - 405, 1988

47087
Interfacial Energy-Controlled Top Coats for Gyroid/Cylinder Phase Transitions of Polystyrene-block-polydimethylsiloxane Block Copolymer Thin Films

Ryu, In Hyu; Kim, Yong Joo; Jung, Yeon Sik; Lim, Jong Sung; Ross, Caroline A.; Son, Jeong Gon, ACS APPLIED MATERIALS & INTERFACES, v.9, no.20, pp.17428 - 17435, 2017-05

47088
Interfacial enhancement between lithium electrode and polymer electrolytes

Choi, Nam-Soon; Lee, YM; Park, JH; Park, Jung-Ki, JOURNAL OF POWER SOURCES, v.119, pp.610 - 616, 2003-06

47089
Interfacial fracture analysis of adhesive-bonded joints

Kim W.-S.; Lee, Jungju, ADVANCED MATERIALS RESEARCH, v.33-37, no.0, pp.327 - 332, 2008

47090
Interfacial fracture energy measurements in the Cu/Cr/polyimide system

Park, YB; Park, IS; Yu, Jin, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.266, no.1-2, pp.261 - 266, 1999-06

47091
Interfacial Instability-Driven Morphological Transition of Prolate Block Copolymer Particles: Striped Football, Larva to Sphere

Lee, Seonghan; Shin, Jaeman J.; Ku, Kang Hee; Lee, Young Jun; Jang, Se Gyu; Yun, Hongseok; Kim, Bumjoon J., MACROMOLECULES, v.53, no.16, pp.7198 - 7206, 2020-08

47092
Interfacial Interaction Engineering of FeCoS@CoMoP for pH-Universal H2 and Alkaline Medium O2 Evolution

Jiao, Danhua; Lu, Wenjuan; Song, Qun; Cai, Xiaodong; Xu, Liangliang; Wang, Qizhao; Du, Haijun, ACS APPLIED NANO MATERIALS, v.6, no.23, pp.21922 - 21933, 2023-11

47093
Interfacial Interactions of Single-Walled Carbon Nanotube/Conjugated Block Copolymer Hybrids for Flexible Transparent Conductive Films

Park, Ho-Seok; Choi, Bong-Gill; Hong, Won-Hi; Jang, Sung-Yeon, JOURNAL OF PHYSICAL CHEMISTRY C, v.116, no.14, pp.7962 - 7967, 2012-04

47094
Interfacial Layer Control by Dry Cleaning Technology for Polycrystalline and Single Crystalline Silicon Growth

Im, Dong-Hyun; Lee, Kong-Soo; Kang, Yoongoo; Jeong, Myoungho; Park, Kwang Wuk; Lee, Soon-Gun; Ma, Jin-Won; et al, JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.16, no.5, pp.4906 - 4913, 2016-05

47095
INTERFACIAL LAYER FORMATION OF THE CDTE/INSB HETEROINTERFACES GROWN BY TEMPERATURE-GRADIENT VAPOR TRANSPORT DEPOSITION

KIM, TW; PARK, HL; Lee, JeongYong; LEE, HJ, APPLIED PHYSICS LETTERS, v.65, no.20, pp.2597 - 2599, 1994-11

47096
INTERFACIAL LAYER FORMATION ON CORRUGATED INP DURING THE EPITAXIAL-GROWTH OF GAINASP/INP DISTRIBUTED-FEEDBACK LASER-DIODE STRUCTURE

Jang, DH; Kim, JS; Park, KH; Lee, JK; Cho, HS; Nahm, S; Lee, SW; et al, JOURNAL OF CRYSTAL GROWTH, v.156, no.4, pp.368 - 372, 1995-12

47097
Interfacial layer properties of HfO2 films formed by plasma-enhanced atomic layer deposition on silicon

Park, PK; Roh, JS; Choi, BH; Kang, SW, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.9, no.5, pp.F34 - F37, 2006-03

47098
Interfacial microrheology of DPPC monolayers at the air-water interface

Kim, KyuHan; Choi, Siyoung Q.; Zasadzinski, Joseph A.; Squires, Todd M., SOFT MATTER, v.7, no.17, pp.7782 - 7789, 2011-09

47099
Interfacial microstructure and joint strength of Sn-3.5Ag-X (X = Cu, In, Ni) solder joint

Choi, WK; Kim, JH; Jeong, SW; Lee, HyuckMo, JOURNAL OF MATERIALS RESEARCH, v.17, no.1, pp.43 - 51, 2002-01

47100
Interfacial microstructure of diffusion-bonded SiC and Re with Ti interlayer

Kim, Joo-Hyung; Kim, Dong-Seok; Lim, Seong Taek; Kim, Do Kyung, JOURNAL OF ALLOYS AND COMPOUNDS, v.701, pp.316 - 320, 2017-04

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