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Showing results 46501 to 46520 of 100201
| Interfacial microstructure and joint strength of Sn-3.5Ag-X (X = Cu, In, Ni) solder joint Choi, WK; Kim, JH; Jeong, SW; Lee, HyuckMo, JOURNAL OF MATERIALS RESEARCH, v.17, no.1, pp.43 - 51, 2002-01 |
| Interfacial microstructure of diffusion-bonded SiC and Re with Ti interlayer Kim, Joo-Hyung; Kim, Dong-Seok; Lim, Seong Taek; Kim, Do Kyung, JOURNAL OF ALLOYS AND COMPOUNDS, v.701, pp.316 - 320, 2017-04 |
| Interfacial microstructure of diffusion-bonded W-25Re/Ti/graphite joint and its high-temperature stability Kim, Joo-Hyung; Baek, Changyeon; Kim, Dong Seok; Lim, Seong Taek; Kim, Do Kyung, Korean Journal of Materials Research, v.26, no.12, pp.751 - 756, 2016-12 |
| Interfacial modification of La0.80Sr0.20MnO3-delta-Er0.4Bi0.6O3 cathodes for high performance lower temperature solid oxide fuel cells Lee, Kang Taek; Jung, Doh Won; Yoon, Hee Sung; Lidie, Ashley A.; Camaratta, Matthew A.; Wachsman, Eric D., JOURNAL OF POWER SOURCES, v.220, pp.324 - 330, 2012-12 |
| Interfacial molecular order of conjugated polymer in P3HT:ZnO bilayer photovoltaics and its impact on device performance Wood, Sebastian; Franklin, Joseph B.; Stavrinou, Paul N.; McLachlan, Martyn A.; Kim, JI Seon, APPLIED PHYSICS LETTERS, v.103, no.15, 2013-10 |
| Interfacial perpendicular magnetic anisotropy in CoFeB/MgO structure with various underlayers Oh, Young-Wan; Lee, Kyeong-Dong; Jeong, Jong-Ryul; Park, Byong-Guk, JOURNAL OF APPLIED PHYSICS, v.115, no.17, pp.17C724, 2014-05 |
| Interfacial plasticity mediated by lath boundaries in reduced-activation ferritic/martensitic steels Ghaffarian, Hadi; Na, Ye-Eun; Jang, Dongchan, JOURNAL OF NUCLEAR MATERIALS, v.559, 2022-02 |
| Interfacial Polymerization of Reactive Block Polymers for the Preparation of Composite Ultrafiltration Membranes Seo, Myungeun; Moll, David; Silvis, Craig; Roy, Abhishek; Querelle, Sarah; Hillmyer, Marc A., INDUSTRIAL & ENGINEERING CHEMISTRY RESEARCH, v.53, no.48, pp.18575 - 18579, 2014-12 |
| Interfacial properties of liquid metal immersed in various liquids Ryu, Gaabhin; Park, Kwangseok; Kim, Hyoungsoo, JOURNAL OF COLLOID AND INTERFACE SCIENCE, v.621, pp.285 - 294, 2022-09 |
| INTERFACIAL PROPERTIES OF MODEL GRAFT-COPOLYMERS CAO, BH; Kim, Mahn-Won; PEIFFER, DG, LANGMUIR, v.11, no.5, pp.1645 - 1652, 1995-05 |
| Interfacial Rashba magnetoresistance of the two-dimensional electron gas at the LaAlO3/SrTiO3 interface Narayanapillai, Kulothungasagaran; Go, Gyungchoon; Ramaswamy, Rajagopalan; Gopinadhan, Kalon; Go, Dongwook; Lee, Hyun-Woo; Venkatesan, Thirumalai; et al, PHYSICAL REVIEW B, v.96, no.6, 2017-08 |
| Interfacial reaction and control of Pt/PZT/Pt by sol-gel process No, Kwangsoo; Ding, Ai-Li; Luo, Wei-Gen; Qiu, Ping-Sun, AMF-2, 1998 |
| Interfacial reaction between 42Sn-58Bi solder and electroless Ni-P/immersion Au under bump metallurgy during aging Cho, MG; Paik, Kyung-Wook; Lee, HyuckMo; Booh, SW; Kim, TG, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.1, pp.35 - 40, 2006-01 |
| Interfacial reaction between aluminum metal and boron-doped polysilicon in a planar type antifuse device Baek, JT; Park, HH; Ahn, Byung Tae; Jun, CH; Kim, YT; Song, YH; Kim, J, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.37, no.5A, pp.2451 - 2454, 1998-05 |
| Interfacial reaction between Sn-1Bi-5In-9Zn solder and Cu substrate Yoon, SW; Choi, WK; Lee, HyuckMo, SCRIPTA MATERIALIA, v.40, no.3, pp.327 - 332, 1999 |
| Interfacial reaction between Sn-Ag-based solder alloys and substrates Choi, WK; Lee, HyuckMo, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.35, no.S, pp.344 - 2, 1999-07 |
| Interfacial reaction in the sputter-deposited SiO2/Ti0.1W0.9 antifuse system Baek, Jong Tae; Park, Hyung-Ho; Cho, Kyung-Ik; Yoo, Hyung Joun; Kang, Sang-Won; Ahn, Byung Tae, JOURNAL OF APPLIED PHYSICS, v.78, no.12, pp.7074 - 7079, 1995-12 |
| Interfacial reaction of Sn-3.5wt%Ag solder alloy with a variance of Ni layer thickness Choi, YG; Lee, HyuckMo, JOURNAL OF THE KOREAN INSTITUTE OF METALS AND MATERIALS, v.37, no.11, pp.1416 - 1421, 1999-11 |
| Interfacial Reaction Product Its Effect on the Strength of Cupper to Alumina Eutetic Bonding S.T. Kim; Kim, Chong Hee, JOURNAL OF MATERIALS SCIENCE, v.27, no.8, pp.2061 - 2066, 1992 |
| Interfacial Reactions and Joint Strengths of Sn-xZn Solders with Immersion Ag UBM Jee, YK; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.39, no.10, pp.2286 - 2291, 2010-10 |
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