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Showing results 39321 to 39340 of 276341
| Bulk flow investigation of solutal Marangoni flow Fuchs, Thomas; Jasper, Alexander; Kim, Hyoungsoo; Kaehler, Christian J, 76th Annual Meeting of the Division of Fluid Dynamics, American Physical Society, 2023-11-20 |
| Bulk handoff analysis of mixed traffic in voice/data integrated wireless networks = 음성/데이터 통합 이동망에서 혼합 트래픽의 벌크 핸드오프 성능 분석link Suh, Youl-Kyu; 서열규; et al, 한국과학기술원, 2002 |
| Bulk mean temperature in porous medium analysis Jang, SP; Kim, SungJin; Choi, SUS, INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v.47, no.25, pp.5603 - 5607, 2004 |
| Bulk Metamaterials Exhibiting Chemically Tunable Hyperbolic Responses Lee, Myeongjeong; Lee, Eunsil; So, Sunae; Byun, Sejin; Son,Jaeseok; Ge, Bangzhi; Lee, Hyungseok; et al, JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, v.143, no.49, pp.20725 - 20734, 2021-11 |
| Bulk Photoconductivity in Photovoltaic Action Spectra of Fullerene-Based Photovoltaic Cells Lim, Koeng Su, , 2001-01-01 |
| Bulk polymerization of polyurethane under high pressure Park, Kang Choo; Kim, Sung Chul, JOURNAL OF APPLIED POLYMER SCIENCE, v.39, no.0, pp.639 - 647, 1988-11 |
| Bulk properties of the chiral metallic triangular antiferromagnets Ni1/3NbS2 and Ni1/3TaS2 An, Yeochan; Park, Pyeongjae; Kim, Chaebin; Zhang, Kaixuan; Kim, Hyeoncheol; Avdeev, Maxim; Kim, Jaewon; et al, PHYSICAL REVIEW B, v.108, no.5, 2023-08 |
| Bulk scale growth of CVD graphene on Ni nanowire foams for a highly dense and elastic 3D conducting electrode Min, Byung Hyun; Kim, Dae-Woo; Kim, Kyoung Hulan; Choi, Hyung Ouk; Jang, Sungwoo; Jung, Hee-Tae, CARBON, v.80, pp.446 - 452, 2014-12 |
| BULK UNIVERSALITY FOR DEFORMED WIGNER MATRICES Lee, JiOon; Schnelli, Kevin; Stetler, Ben; Yau, Horng-Tzer, ANNALS OF PROBABILITY, v.44, no.3, pp.2349 - 2425, 2016-05 |
| Bulk-micromachined circular foil type micro heat-flux sensor Oh, SH; Lee, SH; Jeon, JC; Kim, MH; Lee, Seung Seob, SENSORS AND ACTUATORS A-PHYSICAL, v.132, no.2, pp.581 - 586, 2006-11 |
| Bulk-wave ultrasonic propagation imagers Abbas, Syed Haider; Lee, Jung-Ryul, 2018 Conference on Smart Structures and NDE for Industry 4.0, The international society for optics and photonics, 2018-03 |
| Bulky mesoporous TiO2 structure Cho, Ja Y.; Nam, Woo H.; Lim, Young S.; Seo, Won-Seon; Park, Hyung-Ho; Lee, JeongYong, RSC ADVANCES, v.2, no.6, pp.2449 - 2453, 2012 |
| Bull Cow Mating Expert Systems in Dairy Farms Lee, Keon-Myung; Cho, Choong-Ho; Lee, Kwang-Hyung, Pacific-Asian conference on Expert Systems, 1995, pp.824 - 828, 1995 |
| Bullish/bearish/neutral strategies under short sale restrictions Bae, Kwangil; Kang, Jangkoo; Lee, Soonhee, JOURNAL OF BANKING & FINANCE, v.71, pp.227 - 239, 2016-10 |
| Bullous pemphigoid induced by contact with a Rhus tree Lee, Hye Min; Cho, Young Hun; Koo, Dae Won; Lee, Joong Sun, EUROPEAN JOURNAL OF DERMATOLOGY, v.22, no.5, pp.683 - 684, 2012-09 |
| Bumblebees spontaneously map location of conspecific using geometry and features Lee, Sang Ah; Vallortigara, Giorgio, LEARNING AND MOTIVATION, v.50, pp.32 - 38, 2015-05 |
| Bump-less High Speed Channel on Silicon, Organic and Glass Interposer Kim, Joung-Ho; Lee, Hyunsuk; Kim, Heegon; Kim, Kiyeong; Jung, Daniel H.; Kim, Jonghoon J.; Choi, Sumin; et al, 2014 IEEE International Symposium on Electromagnetic Compatibility(EMC&SIPI), 2014 IEEE International Symposium on Electromagnetic Compatibility(EMC&SIPI), 2014-08-05 |
| Bump-less high-speed through silicon Via (TSV) channel for terabyte/s bandwidth 2.5D/3D IC = 테라바이트 대역폭 2.5차원/3차원 집적회로를 위한 범프 없는 고속 관통 실리콘 비아 채널link Lee, Hyunsuk; 이현석; et al, 한국과학기술원, 2015 |
| Bumpless ball grid array (BBGA) package using a solder resist cavity Kwon, YM; Kang, JS; Kweon, YD; Paik, Kyung-Wook, 59th Electronic Components and Technology Conference, 2009, pp.1552 - 1556, 2009-05-26 |
| Bunched Sparse-view CT using a Moving Multi-slit Collimator Miran Park; Taewon Lee; Cho, Seungryong, IEEE Nuclear Science Symposium and Medical Imaging Conference & Workshop on Room-Temperature Semiconductor X-ray and Gamma-Ray Detectors, IEEE NSS/MIC, 2012-11-02 |
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