Browse by Title
Showing results 205921 to 205940 of 276544
| TSN을 이용한 도로 감시 카메라 영상의 강우량 인식 방법 Zhun, Li; 현종환; 최호진, 한국대기환경학회지, v.34, no.5, pp.735 - 747, 2018-10 |
| TSP 지원 도구 개발을 위한 요구사항 연구 이상훈; 최호진, 소프트웨어공학소사이어티 논문지, v.23, no.2, pp.63 - 73, 2010-06 |
| TSP1 단백질 억제제를 유효성분으로 함유하는 파브리 병의 예방 또는 치료용 약학적 조성물 한용만; 도효상 |
| TSPipe: Learn from Teacher Faster with Pipelines Lim, Hwijoon; Kim, Yechan; YUN, SUKMIN; Shin, Jinwoo; Han, Dongsu, The 39th International Conference on Machine Learning (ICML 2022), pp.13302 - 13312, PMLR, 2022-07 |
| TSPipe: Learn from Teacher Faster with Pipelines Lim, Hwijoon; Kim, Yechan; YUN, SUKMIN; Shin, Jinwoo; Han, Dongsu, The 39th International Conference on Machine Learning, ICML 2022, International Conference on Machine Learning, 2022-07-20 |
| TSS BVHs: Tetrahedron Swept Sphere BVHs for Ray Tracing Subdivision Surfaces Du, P.; Kim, Y. J.; Yoon, Sung-Eui, COMPUTER GRAPHICS FORUM, v.35, no.7, pp.279 - 288, 2016-10 |
| TSS BVHs: Tetrahedron Swept Sphere BVHs for Ray Tracing Subdivision Surfaces Du, Peng; Yoon, Sung Eui; Kim, Young Joon, Pacific Conference on Computer Graphics and Applications, Pacific Grahpics, 2016-10-12 |
| TSSN: 감시 영상의 강우량 인식을 위한 심층 신경망 구조 리준; 현종환; 최호진, 한국차세대컴퓨팅학회 논문지, v.14, no.6, pp.87 - 97, 2018-12 |
| TSTO 발사체의 단분리 시 발생하는 공력간섭에 관한 수치적 연구 = Numerical investigation of the aerodynamic interference of two-stage-to-orbit launch vehicles during stage separationlink 이규란; Lee, Gyu-Ran; et al, 한국과학기술원, 2013 |
| TSUIMS: Implementaion of the UIMS for the Touch Screen Lee, J.; Kim, J.W.; Wohn, Kwang-Yun, 한국정보과학회 HCI 학술대회, pp.109 - 125, 한국정보과학회, 1993 |
| TSUNAMI: Triple Sparsity-Aware Ultra Energy-Efficient Neural Network Training Accelerator With Multi-Modal Iterative Pruning Kim, Sangyeob; Lee, Juhyoung; Kang, Sanghoon; Han, Donghyeon; Jo, Wooyoung; Yoo, Hoi-Jun, IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, v.69, no.4, pp.1494 - 1506, 2022-04 |
| TSV modeling and noise coupling in 3D IC Kim, Joungho; Cho, J.; Kim, J., 3rd Electronics System Integration Technology Conference, ESTC 2010, ESTC 2010, 2010-09-13 |
| TSV mutual inductance effect on impedance of 3D stacked on-chip PDN with multi-TSV connections Pak, Jun So; Cho J.; Kim J.; Lee J.; Lee H.; Park K.; Kim J., 2010 IEEE CPMT Symposium Japan, ICSJ10, 2010-08-24 |
| TSV 기반 3차원 소자의 열적-기계적 신뢰성 윤태식; 김택수, 마이크로전자 및 패키징학회지, v.24, no.1, pp.35 - 43, 2017-03 |
| TSV-based Current Probing Structure using Magnetic Coupling in 2.5D and 3D IC Kim, Jong Hoon; Jung, Daniel Hyunsuk; Kim, Hee Gon; Kong, Sun Kyu; Choi, Su Min; Lim, Jae Min; Kim, Joung Ho, 2015 International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO), 2015 International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO), 2015-11-11 |
| TSV-based Decoupling Capacitor Schemes in 3D-IC Song, Eunseok; Pak, Jun So; Kim, Joungho, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29 |
| TSV를 이용한 3D패키징 공정 및 장비 기술 송준엽; 이재학; 하태호; 이창우; 유중돈, 한국정밀공학회지, v.26, no.12, pp.9 - 17, 2009-12 |
| TTA-COPE: Test-Time Adaptation for Category-Level Object Pose Estimation Lee, Taeyeop; Tremblay Jonathan; Blukis, Valts; Wen Bowen; Lee, ByeongUk; Shin, Inkyu; Birchfield Stan; et al, IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR 2023), IEEE/CVF, 2023-06-21 |
| TTCN판정의 변별력에 대하여 강성원; 김명철; 박용범, COMSW'97(통신학회 주관), 한국통신학회, 1997 |
| TTIP의 열분해에 있어 알콜첨가에 의한 TiO2 입자크기 조절 C-33 김기영; 박승빈, 한국화학공학회 1994년 춘계, 1994 |
Discover
Type
Open Access
Date issued
- 31,517 2020 - 2024
- 99,997 2010 - 2019
- 75,670 2000 - 2009
- 44,727 1990 - 1999
- 14,360 1980 - 1989
- 62 1964 - 1969