| 1 | (A) study on interfacial reactions of Pd added ultra-fine Au bonding wires and Al pads = 팔라듐이 첨가된 초 미세직경 금 본딩 와이어와 알루미늄 패드의 계면 반응에 대한 연구link Shin, Ji-Won; 신지원; et al, 한국과학기술원, 2010 |
| 2 | Application of Electrochemical Quartz Crystal Microbalance Technique to Investigation of the Interfacial Reactions at Metal Electrode/Electrolyte w.-j. lee; Pyun, Su Il, METALS AND MATERIALS INTERNATIONAL, v.6, no.4, pp.331 - 343, 2000 |
| 3 | Carrier Transport at Metal/Amorphous Hafnium-Indium-Zinc Oxide Interfaces Kim, Seoungjun; Gil, Youngun; Choi, Youngran; Kim, Kyoung-Kook; Yun, Hyung Joong; Son, Byoungchul; Choi, Chel-Jong; et al, ACS APPLIED MATERIALS & INTERFACES, v.7, no.40, pp.22385 - 22393, 2015-10 |
| 4 | Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene Ko, Yong Ho; Lee, Jong-Dae; Yoon, Taeshik; Lee, Chang-Woo; Kim, Taek-Soo, ACS APPLIED MATERIALS INTERFACES, v.8, no.8, pp.5679 - 5686, 2016-03 |
| 5 | Effect of Aluminum Concentration on the Interfacial Reactions of Sn-3.0Ag-xAl Solders with Copper and ENIG Metallizations Xia, YH; Jee, YK; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.12, pp.1858 - 1862, 2008-12 |
| 6 | Effect of in addition on Sn-3.5Ag solder and joint with Cu substrate Choi, WK; Yoon, SW; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.42, no.5, pp.783 - 789, 2001 |
| 7 | Effect of under bump metallurgy and reflows on shear strength and microstructure of joint between Cu substrate and Sn-36Pb-2Ag solder alloy Yoon, SW; Kim, JH; Jeong, SW; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.44, no.2, pp.290 - 297, 2003-02 |
| 8 | Effects of minor additions of Zn on interfacial reactions of Sn-Ag-Cu and Sn-Cu solders with various Cu substrates during thermal aging Cho, Moon Gi; Kang, Sung K.; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.36, no.11, pp.1501 - 1509, 2007-11 |
| 9 | Effects of Zn addition on undercooling of Pb-free solder alloys and their interfacial reactions with Cu and Ni-P UBMs = 무연 솔더 합금의 과냉도 및 하부 금속층과의 계면 반응에 미치는 솔더 내 미량 Zn 첨가의 영향link Cho, Moon-Gi; 조문기; et al, 한국과학기술원, 2009 |
| 10 | Interfacial characteristics of solder joint in electronic packaging = 전자 패키징 솔더 접합부의 계면 특성 : 그래핀과 플렉시블 기판의 응용link Ko, Yong-Ho; 고용호; et al, 한국과학기술원, 2017 |
| 11 | Prediction of primary intermetallic compound formation during interfacial reaction between Sn-based solder and Ni substrate Choi, WK; Lee, HyuckMo, SCRIPTA MATERIALIA, v.46, no.11, pp.777 - 781, 2002-06 |
| 12 | Residual stress and interfacial reaction of the electroplated Ni-Cu alloy under bump metallurgy in the flip-chip solder joint Kim, SH; Kim, JY; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.9, pp.948 - 957, 2004-09 |
| 13 | Sn-3.5Ag 솔더의 벌크 특성과 Ni-P 하부 금속층과의 계면반응에 Co의 첨가가 미치는 영향 = Effects of Co addition on bulk properties of sn-3.5ag solder and interfacial reactions with Ni-P UBMlink 김동훈; Kim, Dong-Hoon; et al, 한국과학기술원, 2008 |
| 14 | Sn-Ag-Cu계 솔더 합금과 Cu, Ni 기판의 계면 현상 및 계면 생성물의 성장 거동에 관한 연구 = Studies on interfacial reaction and microstructural evolution of joint interface between Sn-Ag-Cu solder alloy and Cu, Ni substratelink 김종훈; Kim, Jong-Hoon; et al, 한국과학기술원, 2005 |
| 15 | The Crystal Orientation of beta-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy Seo, Sun-Kyoung; Kang, Sung K.; Cho, Moon Gi; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.12, pp.2461 - 2469, 2009-12 |
| 16 | 무연 솔더와 Ni-Cu 합금 UBM 간의 계면 반응 및 신뢰성에 관한 연구 = Study on the reaction and reliability of Ni-Cu alloy UBM with Pb-free solderslink 한훈; Han, Hun; et al, 한국과학기술원, 2005 |
| 17 | 무연솔더 접합부에서의 계면 반응과 기계적 신뢰성과의 연관성에 관한 연구 = A study on correlation between interfacial reaction and mechanical reliability of pb-free solder jointlink 고용호; Ko, Yong-Ho; et al, 한국과학기술원, 2006 |
| 18 | 미세 무연 솔더볼이 계면 반응 및 솔더 조인트 신뢰성에 미치는 영향에 대한 연구 = Studies on the effects of fine size lead-free solder ball on the interfacial reactions and the solder joint reliabilitieslink 박용성; Park, Yong-Sung; et al, 한국과학기술원, 2013 |
| 19 | 실리콘 웨이퍼 접합을 위한 코발트-주석 금속간화합물에 관한 연구 = A study on the Co-Sn IMCs for the silicon wafer bondinglink 김성환; Kim, Sung-Hwan; et al, 한국과학기술원, 2008 |
