실리콘 웨이퍼 접합을 위한 코발트-주석 금속간화합물에 관한 연구A study on the Co-Sn IMCs for the silicon wafer bonding
- Advisors
- 유진researcher; Yu, Jinresearcher
- Description
- 한국과학기술원 : 신소재공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 2008
- Identifier
- 296351/325007 / 020063078
- Language
- kor
- Description
학위논문(석사) - 한국과학기술원 : 신소재공학과, 2008.2, [ vi, 67 p. ]
- Keywords
웨이퍼 접합; 금속간화합물; 코발트-주석; 패키징; 계면반응; wafer bonding; IMCs; cobalt-tin; packaging; interfacial reaction
- Appears in Collection
- MS-Theses_Master(석사논문)
- Files in This Item
- There are no files associated with this item.
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