학위논문(박사) - 한국과학기술원 : 신소재공학과, 2005.8, [ viii, 99 p. ]
wetting properties; interfacial reaction; Pb-free solder; Ni-Cu alloy UBM; realiability; 신뢰성 평가; 젖음 특성; 계면반응; 무연솔더; 니켈-구리 합금 접합층
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