Browse by Subject UBM

Showing results 1 to 16 of 16

1

A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy

Jeon, YD; Nieland, S; Ostmann, A; Reichl, H; Paik, Kyung-Wookresearcher, JOURNAL OF ELECTRONIC MATERIALS, v.32, pp.548 - 557, 2003-06

2

(A) study on the interfacial reaction between lead-free solders and electroplated Ni or Cu metallization and its effect on mechanical reliability = 무연솔더와 전기도금된 니켈 및 구리와의 계면반응과 기계적 신뢰성에 미치는 영향에 관한 연구link

Kim, Jong-Yeon; 김종연; et al, 한국과학기술원, 2008

3

CrCu based UBM (under bump metallization) study with electroplated Pb/63Sn solder bumps - Interfacial reaction and bump shear strength

Jang, SY; Wolf, J; Ehrmann, O; Gloor, H; Schreiber, T; Reichl, H; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.26, no.1, pp.245 - 254, 2003-03

4

Enhancement of adhesion strength of electroless-plated Ni under bump metallurgy by introduction of inductively coupled plasma enhanced bias sputtering Ni seed layer

Kim, ED; Lee, Won-Jongresearcher, JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS EXPRESS LETTERS, v.44, no.50-52, pp.1541 - 1543, 2005-12

5

Pb-free Sn/3.5Ag electroplating bumping process and under bump metallization (UBM)

Jang, Se-Young; Wolf, J; Ehrmann, O; Gloor, H; Reichl, H; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.25, no.3, pp.193 - 202, 2002-07

6

Personalized speech emotion recognition using multi-staged data selection = 다계층 자료 선택 기법을 이용한 화자 적응 기반의 음성 감정 인식link

Kim, Jae-Bok; 김재복; et al, 한국과학기술원, 2011

7

Personalized speech emotion recognition using multi-staged data selection = 다계층 자료 선택 기법을 이용한 화자 적응 기반의 음성 감정 인식link

Kim, Jae-Bok; 김재복; et al, 한국과학기술원, 2011

8

Stencil printing으로 형성한 Pb-free solder bump와 UBM(under bump metallurgy) 간의 계면에 관한 연구 = Interfacil studies on the stencil printed Pb-free solder bump and UBM (under bump metallurgy)link

엄지용; Eom, Ji-Yong; et al, 한국과학기술원, 2000

9

Stresses in electroless Ni-P films for electronic packaging applications

Jeon, YD; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.25, no.1, pp.169 - 173, 2002-03

10

Studies of electroless nickel under bump metallurgy-solder interfacial reactions and their effects on flip chip solder joint reliability

Jeon, YD; Paik, Kyung-Wookresearcher; Bok, KS; Choi, WS; Cho, CL, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.520 - 528, 2002-05

11

Studies of electroless nickel under bump metallurgy—Solder interfacial reactions and their effects on flip chip solder joint reliability

Jeon, Young Doo; Paik, Kyung Wook; Bok, Kyoung Soon; Choi, Woo Suk; Cho, Chul Lae, Journal of Electronic Materials v.31 n.5, 520-528, 2000-01

12

UBM용 Ni 박막 형성 및 특성에 관한 연구 = Fabrication and characterization of the Ni films for the Applications to UBMlink

김응도; Kim, Eung-Do; et al, 한국과학기술원, 2005

13

무전해 니켈 UBM을 이용한 여러 솔더 범프의 계면 반응 및 신뢰성에 관한 연구 = Studies on interfacial reactions and reliabilities of various solder bumps on electroless Ni-P UBMslink

전영두; Jeon, Young-Doo; et al, 한국과학기술원, 2004

14

무전해 니켈 도금법을 이용한 플립칩 접속용 범프 및 하부금속층에 관한 연구 = A study on the Ni flip chip bumps and under bump metallurgy formation using electroless Ni plating methodslink

전영두; Jeon, Young-Doo; et al, 한국과학기술원, 2000

15

인듐 범프를 이용한 VCSEL 어레이의 플립칩 본딩 최적화 = Optimization of flip chip bonding for a VCSEL array using indium bumpslink

주건모; Chu, Kun-Mo; et al, 한국과학기술원, 2003

16

전해도금을 이용한 Ni계 UBM 및 Sn-Ag 솔더 범프 형성 방법 = Fabrication method of Ni based under bump metallurgy and sn-ag solder bump by electroplatinglink

김종연; Kim, Jong-Yeon; et al, 한국과학기술원, 2003

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