학위논문(석사) - 한국과학기술원 : 재료공학과, 2003.2, [ iv, 94 p. ]
솔더댐; 광연결; 플립칩; 인듐솔더범프; 수직공진형 표면방출레이저; 은; silver; UBM; optical interconnection; flip chip; indium solder bump; VCSEL
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