DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, H-S | ko |
dc.contributor.author | Yang, Hyun-Ho | ko |
dc.contributor.author | Ra, S. | ko |
dc.contributor.author | Yoon, Jun-Bo | ko |
dc.date.accessioned | 2013-03-11T16:49:21Z | - |
dc.date.available | 2013-03-11T16:49:21Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2011-06 | - |
dc.identifier.citation | JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.21, no.6 | - |
dc.identifier.issn | 0960-1317 | - |
dc.identifier.uri | http://hdl.handle.net/10203/99643 | - |
dc.description.abstract | Recently, as integration density of electrical devices has increased, multi-layered, fine-patterned printed circuit board (PCB) technology has been advancing. As a high-volume, low-cost manufacturing method, PCB fabrication by imprinting has gained much attention. A large-sized Ni stamp plays a critical role in this method. We thus developed a novel fabrication method for a large-sized multi-level Ni stamp, which imprints patterns directly onto PCB resin, using multi-level patterning of an SU-8 photoresist. In this study, we focused on two aspects: (i) the property of SU-8 adhering to a large-sized glass substrate and (ii) neat and complete removal of SU-8 from the Ni stamp using a self-assembled monolayer. Using the processes we developed which will be described in detail in this paper, we successfully demonstrated a multi-level Ni stamp as large as 190 mm x 190 mm in size. The actual imprinting test exhibited successful results showing suitability of the developed method for large-scale, low-cost and high-volume manufacturing of the advanced PCBs. | - |
dc.language | English | - |
dc.publisher | IOP PUBLISHING LTD | - |
dc.subject | REPLICATION | - |
dc.subject | MICROSTRUCTURES | - |
dc.subject | EXPOSURE | - |
dc.subject | ADHESION | - |
dc.subject | REMOVAL | - |
dc.subject | MASTER | - |
dc.subject | LIGA | - |
dc.title | Fabrication of a large-scale Ni stamp using a multi-level SU-8 photoresist mold for advanced printed circuit board manufacturing | - |
dc.type | Article | - |
dc.identifier.wosid | 000291021900026 | - |
dc.identifier.scopusid | 2-s2.0-79957961123 | - |
dc.type.rims | ART | - |
dc.citation.volume | 21 | - |
dc.citation.issue | 6 | - |
dc.citation.publicationname | JOURNAL OF MICROMECHANICS AND MICROENGINEERING | - |
dc.contributor.localauthor | Yoon, Jun-Bo | - |
dc.contributor.nonIdAuthor | Lee, H-S | - |
dc.contributor.nonIdAuthor | Ra, S. | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordPlus | REPLICATION | - |
dc.subject.keywordPlus | MICROSTRUCTURES | - |
dc.subject.keywordPlus | EXPOSURE | - |
dc.subject.keywordPlus | ADHESION | - |
dc.subject.keywordPlus | REMOVAL | - |
dc.subject.keywordPlus | MASTER | - |
dc.subject.keywordPlus | LIGA | - |
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