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Characterization of Atomic-Layer-Deposited (ALD) Al2O3-Passivated Sub-50-mu m-thick Kerf-less Si Wafers by Controlled Spalling

Lee, Yong Hwan; Cha, Hamchorom; Choi, Sunho; Chang, Hyo Sik; Jang, Boyun; Oh, Jihun, ELECTRONIC MATERIALS LETTERS, v.14, no.3, pp.363 - 369, 2018-05

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