Fatigue life and plastic deformation behavior of electrodeposited copper thin films

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dc.contributor.authorHwangbo, Yunko
dc.contributor.authorSong, Ji Hoko
dc.date.accessioned2013-03-09T16:50:07Z-
dc.date.available2013-03-09T16:50:07Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2010-04-
dc.identifier.citationMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.527, no.9, pp.2222 - 2232-
dc.identifier.issn0921-5093-
dc.identifier.urihttp://hdl.handle.net/10203/96907-
dc.description.abstractUsing a commercial, electrodeposited copper film of 12 mu m thickness, tensile tests, fatigue tests and static loading tests were performed. The elastic modulus, two types of yield strengths, tensile strength and strain-hardening exponent were obtained. Fatigue tests were performed at four levels of mean stresses and cyclic plastic strain and ratcheting strain (monotonic plastic strain) were measured continuously during the tests. Irrespective of mean stress, fatigue life can be well represented by the maximum stress. The monotonic plastic strain at fracture is nearly constant, irrespective of fatigue life or mean stress. Based on the results obtained, the reason why fatigue life can be well represented by the maximum stress is discussed. (C) 2010 Elsevier B.V. All rights reserved.-
dc.languageEnglish-
dc.publisherELSEVIER SCIENCE SA-
dc.subjectMECHANICAL-PROPERTIES-
dc.subjectYOUNGS MODULUS-
dc.subjectCYCLE FATIGUE-
dc.subjectTENSILE-
dc.subjectFRACTURE-
dc.subjectPOLYSILICON-
dc.subjectSTRAIN-
dc.subjectFOILS-
dc.subjectAG-
dc.titleFatigue life and plastic deformation behavior of electrodeposited copper thin films-
dc.typeArticle-
dc.identifier.wosid000275592200007-
dc.identifier.scopusid2-s2.0-76049088768-
dc.type.rimsART-
dc.citation.volume527-
dc.citation.issue9-
dc.citation.beginningpage2222-
dc.citation.endingpage2232-
dc.citation.publicationnameMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING-
dc.identifier.doi10.1016/j.msea.2010.01.016-
dc.contributor.localauthorSong, Ji Ho-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorElectrodeposited copper film-
dc.subject.keywordAuthorTensile test-
dc.subject.keywordAuthorFatigue test-
dc.subject.keywordAuthorMean stress effect-
dc.subject.keywordAuthorCyclic plastic strain-
dc.subject.keywordAuthorRatcheting strain-
dc.subject.keywordPlusMECHANICAL-PROPERTIES-
dc.subject.keywordPlusYOUNGS MODULUS-
dc.subject.keywordPlusCYCLE FATIGUE-
dc.subject.keywordPlusTENSILE-
dc.subject.keywordPlusFRACTURE-
dc.subject.keywordPlusPOLYSILICON-
dc.subject.keywordPlusSTRAIN-
dc.subject.keywordPlusFOILS-
dc.subject.keywordPlusAG-
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