Thermal Resistance of Cycloaliphatic Epoxy Hybrimer Based on Sol-Gel Derived Oligosiloxane for LED Encapsulation

Abstract

Cycloaliphatic epoxy hybrimer bulk was successfully fabricated by thermal curing of cycloaliphatic epoxy oligosiloxane resin synthesized by a sot-gel condensation reaction with methylhexahydrophthalic anhydride (MHHPA) and tetrabutylphosphonium methanesulfonate (TBPM). The composition of MHHPA and TBPM in the resin was optimized to minimize yellowness of the cycloaliphatic epoxy hybrimer bulk. The sample with the optimized composition showed little discoloration upon thermal aging at 120 degrees C for 360 h under an air atmosphere. On the basis of its high thermal stability with appropriate hardness and a high refractive index of 1.55, cycloaliphatic epoxy hybrimer bulk can be used as a LED encapsulant for white LEDs. (C) 2010 Wiley Periodicals, Inc. J Appl Polym Sci 117: 2140-2145, 2010